
Allicdata Part #: | 523002D00000G-ND |
Manufacturer Part#: |
523002D00000G |
Price: | $ 1.08 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-220 1.0W @ 20°C Board Level, Vertica... |
DataSheet: | ![]() |
Quantity: | 1000 |
5000 +: | $ 0.96953 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.180" (29.97mm) |
Width: | 1.000" (25.40mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 1.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 300 LFM |
Thermal Resistance @ Natural: | 13.60°C/W |
Material: | -- |
Material Finish: | Tin |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are devices that transfer and dissipate heat efficiently from certain objects using a combination of heat conduction, radiation, or convection. The 523002D00000G is a high performance, single element, aluminium heat sink specifically designed for a variety of industrial and consumer application fields. It is composed of a semi-hollow cylindrical base, which allows for a larger surface area and better air circulation, as well as a metal heat sink tip that increases cooling efficiency.
The application fields of the 523002D00000G are typically within the industrial sector, where electronic components generate a lot of heat. These components, like high-powered processors, require proper cooling solutions in order to remain operational. The 523002D00000G can be used to dissipate heat quickly and efficiently from such components, improving their performance and lifespan.
The working principle of the 523002D00000G is fairly simple. Heat produced by the electronic components is transferred to the 523002D00000G through either conduction, radiation, or convection, depending on the surrounding environment. The 523002D00000G then disperses the heat into the surrounding air. This helps to lower the temperature of the component, protecting it from potential overloading or overheating.
The 523002D00000G also features an innovative design that helps to increase the efficiency of heat transfer and dispersal. The hollow base of the device encourages air circulation to cool the device more effectively. Additionally, the shape of the device ensures a larger surface area is exposed, which aids in the heat transfer and dispersal process. The unique shape also allows for more efficient positioning of the component within a confined space, improving air flow and heat dissipation.
The 523002D00000G is not only designed to be highly efficient at transferring heat, but also to be robust and reliable. The 523002D00000G is constructed from an aluminium alloy that is strong and durable, ensuring an extended lifespan. Additionally, the device features a robust heat sink tip which offers added protection against potential damage due to high temperatures or mechanical stress.
In conclusion, the 523002D00000G is an innovative and reliable heat sink solution that is suitable for a variety of electronic components. It is highly efficient at transferring and dissipating heat to ensure the performance and longevity of the components. The 523002D00000G is an excellent choice for those in the industrial sector looking for a reliable and robust cooling solution.
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