Allicdata Part #: | 532602B00000-ND |
Manufacturer Part#: |
532602B00000 |
Price: | $ 0.74 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-220 Aluminum 6.0W @ 40°C Board Level |
DataSheet: | 532602B00000 Datasheet/PDF |
Quantity: | 1000 |
4000 +: | $ 0.66062 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 1.500" (38.10mm) |
Width: | 1.650" (41.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | 6.0W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 2.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 5.50°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a vital part of any electronic system. The 532602B00000 is a passively cooled heat sink designed to dissipate and regulate heat away from sensitive and expensive components in a variety of applications. It is designed to be used in a wide range of applications, and has been tested and verified to ensure durability and performance.
The 532602B00000 is a patented heat sink design that is made from high quality aluminum alloy material. It is a high conductivity heat sink that is designed to dissipate heat away from the sensitive components or any chassis that requires heat dissipation. The 532602B00000 is designed to provide maximum cooling efficiency under high load conditions with active cooling methods.
The 532602B00000 features a built-in air-convection cooling mechanism to pull air in from the sides and pass through the fins, resulting in faster heat dissipation. The 532602B00000 has two main parts, the base and the fins. The base is made from highly conductive metal and houses the fins. The fins have small cavities in them that act as mini radiators which help to dissipate heat. The fin design is optimized for maximum cooling performance.
The 532602B00000 is designed to be used in a variety of applications. This passive heat sink can be used in embedded system designs, embedded computer designs, LED lighting systems, and in industrial or medical applications that require reliable cooling. It is also suitable for applications where active cooling methods are not possible.
Using the 532602B00000 in applications requiring effective thermal management is a cost-effective solution. It is easy to install and can be mounted to any flat surface using the convenient mounting options. The 532602B00000 is also designed with weight and size considerations in mind so that it can be easily incorporated into space-limited designs.
The working principle of the 532602B00000 is quite simple. The heat is transferred by conduction from the source to the base of the heat sink. The heat is then dispersed by the fins and the air-convection cooling feature. The fins act as mini radiators that dissipate the heat away from the source and into the surrounding air.
The 532602B00000 is designed with reliability in mind and has been tested to ensure that it can provide maximum cooling efficiency under high load conditions. The 532602B00000 is designed to withstand high temperatures and provide reliable thermal control. The 532602B00000 is a great choice for industrial, medical, and other applications that require efficient thermal management.
The specific data is subject to PDF, and the above content is for reference
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