532602B02500G

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	1.500" (38.10mm)
Width:	1.650" (41.91mm)
Diameter:	--
Height Off Base (Height of Fin):	1.000" (25.40mm)
Power Dissipation @ Temperature Rise:	6.0W @ 40°C
Thermal Resistance @ Forced Air Flow:	2.00°C/W @ 400 LFM
Thermal Resistance @ Natural:	5.50°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal-Heat Sinks

Thermal-Heat Sinks are devices or materials used to absorb and dissipate heat from a specific source. Heat sinks can be used either for air cooling, to reduce the temperatures within electronic components or for coolant cooling, to reduce heat generated by hot liquid or gas passing through pipes. This article will cover the 532602B02500G application field and working principle, an excellent thermal-heat sink solution offered by Aluminum Associates.The 532602B02500G is a lightweight aluminum extrusion heat sink extrusion designed for efficient convection cooling. It is ideal for a number of application, such as LED, power supplies and other electronic devices. The heat sink utilizes a unique fin design, which increases the surface area therefore, enhances heat dissipation. This fin features a stepped shape, which allows for excellent heat dissipation as it increases the turbulence at the air flow-heat sink interface. The 532602B02500G is able to dissipate heat at a vast range of temperatures, while outperforming other thermal-heat sinks with an impressive 59cfm (59 cubic feet per minute) air flow rate and 0.032°C/W (0.0577°F/W) thermal resistance.The 532602B02500G also offers a number of unique and beneficial properties, which make it highly versatile and reliable for a range of commercial and industrial applications. To keep up with the latest technological developments, the 532602B02500G features a number of improvements compared to previous generations. The heat sink is covered by an anodized finish that is corrosion and oxidation resistant. This allows it to maintain its appearance and performance even after long-term usage in extreme conditions. Additionally, the heat sink comes with a wide range of mounting options, including free air, fan-forced, and forced convection-cooling. Furthermore, it features a number of additional features and benefits including optimized pressure drop, integrated air baffles and complimentary backplate.The working principle of the 532602B02500G is relatively simple. When the heat sink is attached to an electronic component, the fins absorb and dissipate the heat away from the surface, which helps to reduce the temperature of the device. The low thermal resistance of this device enables efficient cooling at any temperature, while the fin design increases air velocity and flow for improved heat dissipation. As the heat is dissipated away from the device, the air convection helps to circulate the air inside the heat sink. This further helps to reduce the temperatures and keep the device running efficiently.In conclusion, the 532602B02500G offers a reliable and beneficial thermal-heat sink solution. It is lightweight, durable and offers a number of unique features and benefits, which make it suitable for a variety of applications. The fin design also maximizes air flow and heat dissipation which further improves the device performance. And with its varied mounting options and optimized air flow, the 532602B02500G offers a reliable thermal-heat sink solution for any application.

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