Allicdata Part #: | 532900-3-ND |
Manufacturer Part#: |
532900-3 |
Price: | $ 1.03 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | HDI E.S.D. POWER CONT L.P. |
More Detail: | Contact Gold Power Socket Screw Mount |
DataSheet: | 532900-3 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
2000 +: | $ 0.93261 |
Series: | HDI (High Density Interconnect) |
Packaging: | Bulk |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Type: | Power |
Pin or Socket: | Socket |
Contact Termination: | Screw Mount |
Wire Gauge: | -- |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
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Backplane Connectors - Contacts - 532900-3 application field and working principle
Backplane connectors rely upon a series of contacts to make the necessary electrical connection between different modules in a system. The backplane contacts of the industry-standard 532900-3 connector use spring-loaded beryllium copper pins, featuring good mechanical and electrical strength, with superior electrical and thermal conductivity characteristics. Given the importance of reliably making and breaking electrical connections without damaging the contacts,busing-pin geometry is carefully designed and tested.
The 532900-3 backplane contacts consist of a cylinder pin supported on a steel spring. The spring is designed to be resilient enough to allow a normal insertion and extraction force, but also to provide a uniform withdrawal force. This ensures that the pin is free to slide up and down within the contact interior, but remains flush with the mating surface at all times. The contact is designed with a slot at its base to allow it to be mounted on the substrate board, while a flange provides additional stability and prevents the contact from being dislodged.
The 532900-3 connector also utilizes an angled contact geometry to minimize contact wear and premature connector failure. This contact geometry ensures that, when mated, the pins of the opposite connector are directed downward, ensuring that the contact surfaces remain aligned. This also enables multiple insertion cycles without damaging either the connector or the contact surfaces.
These features make the 532900-3 connector suitable for a variety of applications. These include backplane systems for power distribution, telecommunications, data storage, and military systems. In addition, the 532900-3 connector is also suitable for high-speed interconnects, such as for supercomputing and computer clusters. As a result, the 532900-3 connector has become the de facto standard for high-speed micro-connectors.
To summarize briefly, the 532900-3 backplane connector utilizes a series of spring-loaded beryllium copper pins with angled contact geometry to minimize contact wear. The connector features a resilient steel spring design to ensure uniform withdrawal force, and a mounting slot and flange ensure stability without dislodgement. The 532900-3 is suitable for a variety of applications, including power distribution, telecommunications, data storage, and military systems, and it is the de facto standard for high-speed micro-connectors.
The specific data is subject to PDF, and the above content is for reference
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