533101B02551G

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-218, TO-247
Attachment Method:	Clip and PC Pin
Shape:	Rectangular, Fins
Length:	1.500" (38.10mm)
Width:	1.375" (34.93mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	8.0W @ 80°C
Thermal Resistance @ Forced Air Flow:	3.00°C/W @ 500 LFM
Thermal Resistance @ Natural:	11.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksThe 533101B02551G is a thermal product designed to dissipate heat generated inside electronic circuits. It is a type of heat sink which makes use of conduction, convection and radiation to transfer heat away from a source. The 533101B02551G is widely used in applications which require thermal or heat management solutions such as computers, consumer electronics and other components where heat must be dissipated from the device it is attached to.The 533101B02551G consists of two parts; the base and the cover. The base is the main part of the 533101B02551G which contains a flat aluminum insert. This insert is designed to absorb and dissipate heat from the circuit it is attached to. The base also attaches to the circuit via thermal paste or thermal pads. The cover of the 533101B02551G is the top part which is designed to reflect heat away from the device. It is painted black with a special coating to further enhance the heat transfer of the product.The working mechanism of the 533101B02551G is simple but effective. Heat is generated within the circuit and is absorbed and retained by the aluminum insert on the base. The thermal paste or thermal pad helps to transfer this heat to the bottom of the 533101B02551G. This heat then travels up through the aluminum insert and is dissipated into the surrounding atmosphere through a process of conduction, convection and radiation.The 533101B02551G is capable of dissipating up to 100W of heat from a circuit. This makes it suitable for a variety of applications such as over-clocking a computer’s processor, extending the life of graphics cards and more. The 533101B02551G is also designed in such a way that it is easy to install and requires minimal maintenance.In conclusion, the 533101B02551G is a thermal heat sink designed to dissipate up to 100W of heat generated from electronic circuits. The product consists of a base and a cover which are designed to absorb, reflect and dissipate heat from the circuit. It is suitable for a range of applications and is easy to install and maintain.

The specific data is subject to PDF, and the above content is for reference

Part Number	Manufacturer	Price	Quantity	Description