580100B00000G Allicdata Electronics
Allicdata Part #:

580100B00000G-ND

Manufacturer Part#:

580100B00000G

Price: $ 0.54
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK SLIDE-ON 8-DIP
More Detail: Heat Sink 8-DIP Aluminum 1.0W @ 30°C Top Mount
DataSheet: 580100B00000G datasheet580100B00000G Datasheet/PDF
Quantity: 10664
1 +: $ 0.48510
10 +: $ 0.46368
25 +: $ 0.44050
50 +: $ 0.42890
100 +: $ 0.42311
250 +: $ 0.39413
500 +: $ 0.37094
1000 +: $ 0.33617
5000 +: $ 0.32458
Stock 10664Can Ship Immediately
$ 0.54
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: 8-DIP
Attachment Method: Press Fit, Slide On
Shape: Rectangular, Fins
Length: 0.562" (14.27mm)
Width: 0.600" (15.24mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are devices designed to absorb and disperse heat away from sensitive components or materials. Their primary purpose is to protect components from overheating, and to control the heat output of larger systems. Heat sinks are widely used in consumer electronics, telecommunications, medical, aerospace and defense applications, as well as industrial applications.The 580100B00000G thermal heat sink is an ideal heat sink solution for applications with limited space. It has a small size, low profile, and low power dissipation. This makes it perfect for applications where space and power conservation are paramount. The 580100B00000G is designed to maximize heat transfer and minimize thermal resistance.The working principle of the 580100B00000G thermal heat sink is based on the physics of heat transfer. Heat is dissipated from the heat-generating components of a system, such as a CPU, to the heat sink, which then dissipates the heat to the surrounding air. The heat sink is made up of an aluminum fin array that acts as a surface area from which heat can move quickly. The fins of the heat sink are designed to maximize the surface area in contact with the air, allowing for better air circulation and heat transfer.The heat sink also contains an integrated fan that helps circulate the air around the fins, further increasing the rate at which heat is transferred away from the source. The fan also helps to reduce noise levels, as the fan can be adjusted to spin at different speeds. The fan helps to ensure that the heat sink runs at an optimal temperature.The 580100B00000G thermal heat sink is an ideal choice for applications that demand high efficiency. It offers excellent thermal transfer performance, with low temperature swings and reliable operation. The design features a low profile, making it perfect for space-constrained applications. It is also designed to be cost-effective and easy to install and maintain.Overall, the 580100B00000G thermal heat sink is an excellent solution for applications that require an efficient, space-saving, and cost-effective heat sink. It is designed to maximize heat transfer, while also minimizing noise and thermal resistance. With its low profile, low power dissipation, and efficient operation, the 580100B00000G is the perfect choice for any application where heat transfer and power conservation are important.

The specific data is subject to PDF, and the above content is for reference

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