580100W00000G Allicdata Electronics
Allicdata Part #:

580100W00000G-ND

Manufacturer Part#:

580100W00000G

Price: $ 1.26
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink 8-DIP Aluminum 1.0W @ 30°C Top Mount
DataSheet: 580100W00000G datasheet580100W00000G Datasheet/PDF
Quantity: 1000
5000 +: $ 1.13258
Stock 1000Can Ship Immediately
$ 1.26
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: 8-DIP
Attachment Method: Press Fit, Slide On
Shape: Rectangular, Fins
Length: 0.562" (14.27mm)
Width: 0.600" (15.24mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

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T he thermal - heat sinks 580100W00000G are an indispensable component in a variety of electronics devices and equipment. They serve a critical role by helping to absorb excess energy, regulate temperatures, and dissipate heat. Furthermore, thermal heat sinks are widely used in fields such as telecommunications, nuclear power plants, and other delicate or tightly regulated environments.

The thermal heat sink 580100W00000G consists of a structure with a series of metal plates that create pockets or channels over which cooling air can be directed. The heat produced by the device is then transferred to the metal plates, which absorbs it. This heat is then dissipated into the surrounding air, usually through fans or other means.

The 580100W00000G thermal heat sink is designed to effectively move heat away from a component or other surface and to limit the temperature increase. To this end, the design of the heat sink is highly customizable with several different shapes, sizes, and materials. This enables engineers to ensure their heat sinks are able to adequately dissipate the heat of particular components or devices.

The 580100W00000G thermal heat sink is highly efficient and can be relied upon to dissipate heat quickly and evenly. The metal plates on the heat sink are integral to its working principle. The metal plates are highly conductive to heat, enabling them to quickly absorb heat from the component or device and spread it across its surface. The metal plate also gives the heat sink the ability to evenly distribute heat across its surface, reducing ‘hot spots’ that are common with other heat dissipation methods.

The 580100W00000G thermal heat sink is an effective and versatile design suitable for many different applications and industries. Its ability to rapidly and evenly dissipate heat is essential for devices such as processors, graphics cards, and other components that are particularly sensitive to excess heat build-up.

The 580100W00000G thermal heat sink is easy to install and maintain, making it a cost-effective solution for many applications. Furthermore, its versatile design means that it can be used in many different situations and environments. Finally, its durability makes it an ideal choice for ensuring the longevity and reliability of any device or component.

In summary, the 580100W00000G thermal heat sink is an indispensable component in a variety of electronics devices and equipment. It is highly efficient in dissipating heat, highly customizable, and easy to install and maintain. Furthermore, its use is paramount in ensuring the longevity and reliability of sensitive components in highly regulated environments.

The specific data is subject to PDF, and the above content is for reference

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