| Allicdata Part #: | 6038BG-ND |
| Manufacturer Part#: |
6038BG |
| Price: | $ 0.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
| Short Description: | BOARD LEVEL HEAT SINK |
| More Detail: | Heat Sink TO-220 Aluminum 2.0W @ 40°C Board Level,... |
| DataSheet: |  6038BG Datasheet/PDF |
| Quantity: | 1000 |
| 6000 +: | $ 0.88839 |
| Series: | -- |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Clip and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.180" (29.97mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 2.0W @ 40°C |
| Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | 18.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The 6038BG application field concerns all high-end electrical systems, including, but not limited to, personal computers, industrial control systems, telecommunication equipment, biomedical systems, automotive systems, power electronics, and military systems. Essentially, 6038BG can be used anywhere that generates a large amount of heat, due to the large amount of current that they are capable of handling.
The 6038BG heat sink works by absorbing heat generated by electronic components and dissipating it into the surrounding environment. This is achieved by the heat sink’s thermal conductivity, which is the rate at which it can transfer thermal energy from one point to another. The heat is then removed from the components by the heat sink and dissipated into the surrounding environment, thus cooling the components and preventing them from overheating. The use of heat sinks allows for the efficient cooling of electronic components by removing heat from them and dissipating it into the environment without the need for additional cooling systems.
The 6038BG heat sink is especially effective in confined spaces due to its low profile design, which allows it to fit into even the smallest of spaces. Furthermore, its superior cooling capabilities are due to its high thermal conductivity. This is due to the construction of the heat sink, which is comprised of a flat plate base and a heat-pipe structure. The heat-pipe structure is composed of a series of flat, tightly wound copper tubes that are connected together and covered with a layer of high-heat conducting material, such as aluminum or copper. This allows the heat generated by the electronic components to be transferred from the heat sink into the surrounding environment, where it can dissipate and be removed.
Overall, the 6038BG application field and working principle is extremely beneficial to any enclosure system that needs to dissipate large amounts of heat generated by electronic components. It is also well-suited for use in confined spaces, due to its low-profile design and its superior thermal conductivity. Its ability to efficiently dissipate heat into the environment without the need for additional cooling systems makes it a very attractive choice for enclosure systems that require effective cooling solutions.
The specific data is subject to PDF, and the above content is for reference
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