6038DG

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Clip and PC Pin
Shape:	Rectangular, Fins
Length:	1.180" (29.97mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	2.0W @ 40°C
Thermal Resistance @ Forced Air Flow:	8.00°C/W @ 500 LFM
Thermal Resistance @ Natural:	18.00°C/W
Material:	Aluminum
Material Finish:	Tin

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Introduction

Thermal heat sinks are devices which are designed to keep temperatures of electronic components in specific ranges when exposed to varying temperatures and forced airflows. 6038DG is an example of a thermal heat sink designed to meet rigorous requirements of surface mount components.

Application Field

6038DG has a range of applications, including consumer electronics, automotive, industrial, medical, telecommunication and aerospace uses. It is suitable for use outdoors, in factories, and in other locations where temperatures may vary. Its robust design allows it to withstand temperature variation and remain effective in a wide range of climates.

Design

6038DG is made with a gallium aluminum alloy with a high thermal conductivity and a unique fin-shaped design. It features high-efficiency heat dissipation design with large volume surface area, minimized air resistance, and a low profile for easier placement in tight or congested spaces. Additionally, its heat transfer materials make it robust and capable of withstanding temperatures up to 200°C without significant deformation or damage.

Features

6038DG has many impressive features, such as a built-in heat pipe to provide additional heat transfer. The built-in heat pipe maximizes heat dissipation by providing a direct path for the heat to travel from the center of the device to the sides for even levels of heat distribution. It also has an efficient venting design to ensure proper air circulation and efficient heat transfer.

Working Principle

The working principle of 6038DG is simple. When the temperature of the device rises, the metal fins of the heat sink absorb the heat and the air inside it is circulated. This air contains heat and travel to the fins where it is released, cooling the device. The heat generated by the device is then dissipated through the heat sink\'s fins, keeping the device at a stable temperature.

Conclusion

6038DG is an excellent example of a thermal heat sink that is designed to provide efficient heat transfer and keep electronic components in an optimal temperature range. Its robust design and efficient air circulation system make it an ideal choice for a broad range of applications. It is an excellent choice for optimal heat sink performance and reliable heat transfer.

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