Allicdata Part #: | 6045B-ND |
Manufacturer Part#: |
6045B |
Price: | $ 1.13 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-220 Aluminum 1.0W @ 30°C Board Level |
DataSheet: | 6045B Datasheet/PDF |
Quantity: | 1000 |
10000 +: | $ 1.01194 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Clip |
Shape: | Rectangular |
Length: | 1.000" (25.40mm) |
Width: | 0.750" (19.05mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.350" (8.89mm) |
Power Dissipation @ Temperature Rise: | 1.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 16.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 26.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 6045B is a type of thermal - heat sink which plays an important role in dissipating the heat generated by electronic components and circuits. It is widely used in applications ranging from high performance computing systems to consumer audio and video products.
A heat sink is basically a passive cooling device which helps to remove the excess heat from an electronic component and redistribute it to the surrounding environment. It is often made from metal or other thermally conductive materials such as aluminum, copper or graphite. The primary purpose of the heat sink is to increase the surface area for dissipating heat.
The 6045B thermal - heat sink is composed of a cold plate or base, a fin stack, and two side plate. The fin stack is made from an extruded aluminum fin, which is designed to maximize the surface area contact with the air. The air-side fin design minimizes the conduction pressure drop and increases air flow for improved cooling performance. The base of the heat sink is made of aluminum and provides good thermal conductivity to ensure efficient heat dissipation.
The two side plates are connected to the base and the fin stack to provide stability and additional surface area. They are designed to create turbulence and reduce the airflow resistance around the heat sink. This helps to further improve the heat dissipation performance of the heat sink.
The 6045B thermal - heat sink is designed for use in environments which require high performance cooling. It is commonly used in industrial applications where high performance air cooling is needed. It is also popular for use in servers, gaming systems, and other applications which generate large amounts of heat.
The 6045B thermal - heat sink is designed to provide excellent cooling performance even in extreme temperatures. It is designed to withstand extreme temperatures of up to +150°C and has a thermal conductivity of more than 250W/mK. This makes it ideal for applications which require high levels of cooling. Additionally, the 6045B has a low noise profile despite its high performance levels.
The working principle of the 6045B thermal - heat sink is quite simple. Heat is generated by an electronic component or circuit. This heat is transferred to the cold plate of the heat sink via thermal conduction. The fins of the heat sink then absorb the heat and dissipate it into the surrounding environment. By removing the heat generated by the electronic component or circuit, the performance of the system is increased and the lifespan of the component or circuit is extended.
In conclusion, the 6045B is a high performance thermal - heat sink which is designed to provide excellent cooling performance even in extreme temperatures. It is used in applications which require high levels of cooling, such as industrial equipment, servers, and gaming systems. It is composed of a cold plate, a fin stack, and two side plates. Its working principle is to transfer the heat generated by an electronic component or circuit to the cold plate, absorb the heat and dissipate it into the surrounding environment.
The specific data is subject to PDF, and the above content is for reference
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