7022B-MTG Allicdata Electronics
Allicdata Part #:

7022B-MTG-ND

Manufacturer Part#:

7022B-MTG

Price: $ 1.70
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-220 TAB FOLD 55.12MM
More Detail: Heat Sink TO-220 Aluminum 10.0W @ 70°C Board Level...
DataSheet: 7022B-MTG datasheet7022B-MTG Datasheet/PDF
Quantity: 1766
1 +: $ 1.54350
10 +: $ 1.50381
25 +: $ 1.46286
50 +: $ 1.38159
100 +: $ 1.30032
250 +: $ 1.21905
500 +: $ 1.17841
1000 +: $ 1.05651
5000 +: $ 1.03620
Stock 1766Can Ship Immediately
$ 1.7
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 1.968" (49.99mm)
Width: 1.986" (50.44mm)
Diameter: --
Height Off Base (Height of Fin): 0.375" (9.52mm)
Power Dissipation @ Temperature Rise: 10.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 1.75°C/W @ 800 LFM
Thermal Resistance @ Natural: 6.50°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management plays an important role when it comes to the cooling of different electronic components. Heat sinks are a commonly used active thermal management component that dissipates heat from a component by dissipating it into the surrounding air. The 7022B-MTG is a heat sink for use in cooling various components and other applications. This article will discuss the application field and working principle of the 7022B-MTG.

The 7022B-MTG is a customizable heat sink designed to meet the needs of electronic components, which require effective cooling. It is a high quality extruded aluminum heat sink designed to dissipate heat to the surrounding environment. It is available in a range of different sizes and shapes, allowing it to be adapted to fit almost any application. This makes it a popular choice for a variety of different applications.

The 7022B-MTG is typically used for heat dissipation applications in consumer electronics. For example, it is used for cooling components such as CPUs, GPUs, DSP chips, embedded electronics, and FPGAs. It is also used in larger scale applications, such as in server farms and data centers, where efficient cooling is necessary to maintain high performance levels. The 7022B-MTG can be used in any environment where effective cooling is needed.

The 7022B-MTG works by dissipating heat from the component to the surrounding environment using a combination of convection, radiation, and conduction. Heat is transferred from the component to the heat sink through a combination of convection and conduction, which then dissipates the heat into the surrounding air by radiation. This helps to ensure that the component remains at an optimal temperature, allowing it to run safely and efficiently.

The 7022B-MTG also provides a degree of resistance to prevent the component from overheating in situations where ambient temperatures are high. This is done by providing an additional layer of insulation to the components, which helps to protect them from any excessive heat generated. The 7022B-MTG also helps to reduce the amount of noise generated by the component, which helps to improve its efficiency.

The 7022B-MTG is designed to be simple to install and use, making it an ideal choice for cooling a variety of different components. It is easy to install and requires minimal maintenance, making it a cost-effective solution for cooling multiple components. This makes it a popular choice for a variety of applications, including consumer electronics, servers, and data centers.

In summary, the 7022B-MTG is a heat sink designed for use in cooling various components in different applications. It is designed to provide effective cooling and protection against overheating. It is also easy to install and requires minimal maintenance, making it a cost-effective choice for a variety of applications. Therefore, the 7022B-MTG is an ideal choice for any application that requires effective thermal management.

The specific data is subject to PDF, and the above content is for reference

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