
Allicdata Part #: | 7024BG-ND |
Manufacturer Part#: |
7024BG |
Price: | $ 0.40 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-220 Aluminum 9.0W @ 60°C Board Level,... |
DataSheet: | ![]() |
Quantity: | 1000 |
12000 +: | $ 0.35954 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 1.620" (41.15mm) |
Width: | 2.000" (50.80mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.750" (19.05mm) |
Power Dissipation @ Temperature Rise: | 9.0W @ 60°C |
Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 5.60°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal heat sinks have become increasingly important in the modern era, and the advent of the 7024BG application field and working principle brings even more potential for innovation in this particular area. From a technical standpoint, this device is a type of integrated circuit (IC) which is often referred to as a "heat sink". Its purpose is to absorb and spread the thermal energy created by the components of an electronic system, thus providing the necessary cooling to protect those components from overheating. By doing so, it also helps to regulate the temperature of the system.
In specific terms, the 7024BG application field and working principle is designed to provide energy management for a variety of electronic devices and systems. In general, it works by capturing and storing the energy that is released by the circuit components, converting it into thermal energy, and then actively dissipating that thermal energy away from the components. This process of energy capture and dissipating is performed via a number of different thermal conduction mechanisms. Such mechanisms include convection, radiation, and conduction, and vary based on the particular system and component being cooled.
The 7024BG application field and working principle also offers benefits in terms of efficiency. By actively dissipating the thermal energy away from the components of the circuit, it allows for the components to operate at higher speeds without overheating. This increased efficiency, in turn, leads to a decrease in the amount of energy required to maintain operational temperatures. As a result, the 7024BG application field and working principle can help to improve the overall efficiency of the entire system.
In terms of benefits, the 7024BG application field and working principle offer numerous advantages over traditional thermal management systems. First, they are small and lightweight, making them easy to install and efficient to use. Additionally, they allow for a greater level of thermal control, allowing users to precisely adjust temperatures and balance temperatures across the system. Finally, these heat sinks are also highly reliable and efficient, offering a long lifespan and cost-effective operation.
The 7024BG application field and working principle also features a variety of advanced features that make it even more attractive. For example, it is capable of powering multiple components simultaneously, allowing for improved energy management and thermal regulation in complex systems. Additionally, this heat sink also features a variety of mounting options, making it easy to install in any type of system. Finally, the 7024BG application field and working principle also offers protection against any potential artifact issues that may arise during operation.
In conclusion, the 7024BG application field and working principle offers several advantages over traditional thermal management systems. From its small size and lightweight design, to its advanced features like multiple component simultaneous powering and multiple mounting options, this device brings yet another layer of energy management and thermal regulation to the modern electronic system. With its enhanced efficiency, improved thermal control, and long lifespan, the 7024BG application field and working principle makes it an attractive thermal management solution for any system.
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Part Number | Manufacturer | Price | Quantity | Description |
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7024L20G | IDT, Integra... | -- | 1000 | IC SRAM 64K PARALLEL 84PG... |
7024S55JI | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |
70246-3001 | Molex, LLC | 1.84 $ | 1000 | CONN HEADER 30POS .100 VE... |
70247-2451 | Molex, LLC | 0.97 $ | 1000 | CONN HEADER 24POS .100 R/... |
70247-2001 | Molex, LLC | 0.0 $ | 1000 | CONN HEADER 20POS .100 R/... |
M39003/01-7024/HSD | Vishay Sprag... | 2.31 $ | 1000 | CAP TANT 4.7UF 10% 10V AX... |
7024AK | TE Connectiv... | 417.09 $ | 1000 | RELAY TIME DELAYTime Dela... |
7024ABT | TE Connectiv... | 461.51 $ | 1000 | RELAY TIME DELAYTime Dela... |
7024L15PFG8 | IDT, Integra... | 12.73 $ | 1000 | IC SRAM 64K PARALLEL 100T... |
70247-1402 | Molex, LLC | 0.0 $ | 1000 | CONN HEADER 14POS .100 R/... |
BCD 160 KRD-7024 | Bopla Enclos... | 5.56 $ | 1000 | TERM COMPART LID 44X188X1... |
7024S35PF8 | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 100T... |
70247-4002 | Molex, LLC | 0.0 $ | 1000 | CONN HEADER 40POS .100 R/... |
70247-2052 | Molex, LLC | 1.09 $ | 1000 | CONN HEADER 20POS .100 R/... |
BCD 160 OT-G-7024 | Bopla Enclos... | 22.13 $ | 1000 | HINGED LID 179X199X36.5Pl... |
7024S15JI8 | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |
7024L35JI/2703 | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |
7024L25J | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |
7024S15PFI8 | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 100T... |
7024S55PFI | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 100T... |
70246-4421 | Molex, LLC | 0.0 $ | 1000 | CONN HEADER 44POS .100 VE... |
7024RBT | TE Connectiv... | 0.69 $ | 1000 | RELAY TIME DELAYTime Dela... |
7024S55FB | IDT, Integra... | 232.27 $ | 1000 | IC SRAM 64K PARALLEL 84FL... |
7024L45J | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |
70247-2401 | Molex, LLC | 0.0 $ | 1000 | CONN HEADER 24POS .100 R/... |
70247-4001 | Molex, LLC | 0.0 $ | 1000 | CONN HEADER 40POS .100 R/... |
7024VHT | TE Connectiv... | 425.15 $ | 1000 | RELAY TIME DELAYTime Dela... |
7024.9150 | Schurter Inc... | 0.0 $ | 1000 | FUSE CARTRIDGE 310MA 300V... |
7024L20PFGI8 | IDT, Integra... | 12.73 $ | 1000 | IC SRAM 64K PARALLEL 100T... |
M55-7024042R | Harwin Inc. | 0.72 $ | 300 | CONN HDR 1.27MM DUAL SMD ... |
70247-2602 | Molex, LLC | 0.0 $ | 1000 | CONN HEADER 26POS .100 R/... |
70247-1652 | Molex, LLC | 0.88 $ | 1000 | CONN HEADER 16POS .100 R/... |
7024RKIV | TE Connectiv... | 646.79 $ | 1000 | RELAY TIME DELAYTime Dela... |
BCD 400 OT-FSC-7024 | Bopla Enclos... | 36.56 $ | 1000 | HINGED LID 344X404X37.5MM... |
7024S25J | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |
7024S55J | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |
7024BG | Aavid, Therm... | 0.4 $ | 1000 | BOARD LEVEL HEAT SINKHeat... |
70247-5052 | Molex, LLC | 2.66 $ | 1000 | CONN HEADER 50POS .100 R/... |
7024L55JI8 | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |
7024S25JI8 | IDT, Integra... | 0.0 $ | 1000 | IC SRAM 64K PARALLEL 84PL... |