833802T00000 Allicdata Electronics
Allicdata Part #:

CR491-ND

Manufacturer Part#:

833802T00000

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Comair Rotron
Short Description: HEATSINK STAMP 13.1X13.2X24MM
More Detail: Heat Sink TO-220 Copper 0.5W @ 20°C Board Level, V...
DataSheet: 833802T00000 datasheet833802T00000 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Shape: Rectangular, Fins
Length: 0.848" (21.55mm)
Width: 0.520" (13.21mm)
Diameter: --
Height Off Base (Height of Fin): 0.515" (13.08mm)
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 500 LFM
Thermal Resistance @ Natural: --
Material: Copper
Material Finish: Tin
Description

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Thermal - Heat Sinks

The 833802T00000 thermal-heat sink is a device used to capture and dissipate heat generated by electronic components. It is designed to maintain the temperature of a component within its recommended temperature range and even to keep it below that range if necessary. The 833802T00000 thermal-heat sink can be used in a variety of applications, from basic electronic components, such as motherboards, to military applications, such as satellite and radar systems.

Heat sinks consist of a large metal block that is designed to provide a surface area on which heat can be dissipated from the electronic component. The heat sink block is usually made from aluminum, copper, or sometimes other materials. The 833802T00000 thermal heat sink has two main components - the finned surface and the base plate. The finned surface is a large sheet that is cut and folded to create channels or fins. The fins increase the surface area over which thermal energy can be dissipated away from the component.

The base plate is designed to provide a secure connection between the heat sink and the component itself. The base plate holds the device in place as it transfers thermal energy away from the component. The 833802T00000 thermal heat sink also features an adhesive backing which helps to provide a secure connection between the base plate and the component.

The 833802T00000 thermal-heat sink works by dissipating heat from the electronic component to the surrounding air. Heat is generated by electronic components when they are powered on and working. This heat needs to be dissipated away from the component in order to keep it within its operating temperature range. The 833802T00000 thermal-heat sink enables this by providing a large surface area on which the thermal energy can be dissipated.

The 833802T00000 thermal-heat sink also features a fan, which helps to move the hot air away from the component and to cool the component. The fan is designed to move a large volume of air to ensure that the electronic component is kept within its specified temperature range. The fan is also designed to be adjustable, allowing users to adjust the speed with which the fan runs, depending on their needs and the environment in which the device is being used.

The 833802T00000 thermal-heat sink is a versatile and reliable device which is ideal for use in a wide variety of applications, from consumer electronics, such as TVs, laptops, and tablets, to industrial applications, such as military and aerospace systems. It is designed to maintain the temperature of electronic components within their recommended temperature range, helping to ensure their reliability and longevity.

The specific data is subject to PDF, and the above content is for reference

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