A3P400-1FG256I

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The A3P400-1FG256I is a Field Programmable Gate Array (FPGA) from Actel Corporation. It is a powerful, low-power, space-saving, multi-function IC that offers designers a variety of features, including a large number of logic gates, multiplexers, and other devices. As a member of the ProASIC Plus family, the A3P400-1FG256I offers design flexibility and an integrated design environment.

The A3P400-1FG256I can be used in a wide range of applications due to its flexibility, including automotive, industrial, consumer, military and aerospace applications. It is also suitable for DSP, ASIC prototyping, high-speed communication, and digital signal processing.

The A3P400-1FG256I is a highly-integrated FPGA that combines a number of features. It includes up to 400,000 logic elements and 256 Kbits of embedded memory, as well as features such as high-speed memory control logic and interface, accurate on-chip clock domain crossing detection and protection, and hot-swappable clocking. It also features low-skew between built-in clock sources and a wide selection of pre-configured I/O designs.

The A3P400-1FG256I has an embedded microcontroller that is used to manage the device and program the FPGA. The embedded microcontroller is utilized to read, process and execute firmware in order to program and reconfigure the errored memory cells in the on-chip SRAM.

The A3P400-1FG256I utilizes a wide variety of I/O pins in order to support a wide range of applications. It has the ability to support a variety of operation modes, such as one-bit operation, asynchronous operation, PECL operation, and operation with synchronous inputs. Its I/O pins can be used to support multiple I/O standard interfaces, including Ethernet, USB, serial ATA, PCI Express, and others.

The A3P400-1FG256I also features an active power management system. This enables the system to operate in low-power modes when the device is not in use and allows the system to be powered down when the application is not in use. This reduces power consumption and heat dissipation.

The A3P400-1F256I also features an advanced die-to-die signal integrity improvement feature. This feature allows the device to detect die-level cross-talk and signal integrity violations and dynamically reconfigure the internal logic to improve signal integrity. This feature helps reduce the overall size and complexity of the system, as well as reduces the number of layers required for board design.

The A3P400-1FG256I is a powerful and versatile FPGA that can be used in a variety of applications. It offers designers a wide range of features and an integrated design environment that allows them to create custom solutions. With its low-power operation, flexible I/O support, and advanced signal integrity improvement feature, the A3P400-1FG256I is an ideal solution for embedded applications.

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