ADM1175-3ARMZ-R7

Introduction

The ADM1175-3ARMZ-R7 is a dual hot-swap controller IC. Pegged as a PMIC, or Power Management IC, this chip is ideal for providing protection in a wide range of applications. It’s a key component in high-efficiency, low-cost, applications where it is important to protect against unexpected power surges.

Application Field

The ADM1175-3ARMZ-R7 is most often used in board-level applications or system-level applications where high power dissipation and reliability are important. Its features include:

• Hot swap control (load segment)
• Voltage scaling
• Integrated ADC for temperature monitoring
• Programmable current limit and current limit foldback
• Precise internal power management
• i.MX SoC compatible

With these features, it is well suited to be used in applications such as server board and rack-level hot swap control, CPU power delivery, board-level power sequencing, power rail hot swap control, fan controllers, and LED lighting.

Working Principle

The ADM1175-3ARMZ-R7 is designed to protect a system from over-voltage and current overload conditions. It works by monitoring the voltage and current on the power rail, and if either exceed set threshold it will momentarily disconnect the power line. A few milliseconds later, the power will be reconnected if the source has come back into a safe range. This is known as load segmenting.

The ADM1175-3ARMZ-R7 includes an integrated ADC to monitor its internal temperature. This makes the chip suitable for harsh environments, such as when there is a large temperature differential across the board. Furthermore, the chip is configurable to drive either N-channel or P-channel transistor-based hot swap implementations.

Conclusion

In conclusion, the ADM1175-3ARMZ-R7 is an ideal PMIC for protecting your application from unexpected power surges and load segmenting. Its features make it a great choice for high-performance and long-term reliability. It can be used in a wide range of applications, including server board and rack-level hot swap control, CPU power delivery, board-level power sequencing, power rail hot swap control, fan controllers, and LED lighting.