AER19-19-15CB/A01 Allicdata Electronics
Allicdata Part #:

AER19-19-15CB/A01-ND

Manufacturer Part#:

AER19-19-15CB/A01

Price: $ 3.33
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER19-19-15CB/A01 datasheetAER19-19-15CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.02098
Stock 1000Can Ship Immediately
$ 3.33
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 0.732" (18.60mm)
Width: 0.732" (18.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.575" (14.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.92°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.45°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks may not be the most glamorous form of technology, but they are a vital component for the operation of a variety of electro-mechanical devices. The AER19-19-15CB/A01 heat sink is an example of modern heat sink technology, and it is designed to dissipate excess heat generated by an electronic component before any damage can occur. In this article, we will examine the application field and working principle of the AER19-19-15CB/A01 heat sink.

The AER19-19-15CB/A01 heat sink is designed to provide increased thermal dissipation to reduce the operating temperature of an electronic component or system. The heat sink has a study aluminium alloy base that is resistant to corrosion, making it an ideal choice for operating in a range of environmental conditions. The heat sink also has a raised finned section that is designed to provide increased surface area for heat dissipation. This raised finned section makes the AER19-19-15CB/A01 heat sink capable of dissipating up to 4 watts of thermal energy.

The AER19-19-15CB/A01 heat sink is widely used in the electronics industry. It is commonly used to cool microprocessors, as it is capable of providing increased thermal dissipation while still being compact enough to fit into tight spaces. The heat sink is also used in a variety of other systems, such as power supplies and gaming consoles, to ensure that any excess heat generated by these devices is efficiently dissipated.

The AER19-19-15CB/A01 heat sink operates on a simple principle – it works by transferring heat from the source to the dissipator. This is done using the heat sink’s aluminum alloy base plate, which transfers the heat from the source to the finned section. This is then dissipated into the surrounding environment. The raised finned section of the heat sink increases the surface area of the dissipation process, allowing more heat to be dissipated in a shorter amount of time.

The AER19-19-15CB/A01 heat sink is an indispensable component in the operation of a variety of electronic devices, and its efficient thermal dissipation capabilities make it an invaluable asset. Its corrosion resistant design and increased surface area for heat dissipation make it ideal for a variety of applications, and its ability to keep the internal components of electronic devices cool and safe makes it an indispensible part of any electronic device operating in extreme conditions.

The specific data is subject to PDF, and the above content is for reference

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