AER19-19-18CB/A01

Series:	AER
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Fins
Length:	0.732" (18.60mm)
Width:	0.732" (18.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.693" (17.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.52°C/W @ 200 LFM
Thermal Resistance @ Natural:	14.95°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction

AER19-19-18CB/A01 is a thermal-heat sink designed to cool down space, components, and other objects where the heat must be dissipated. This cooling system has proven to be very efficient and reliable, which makes it one of the most popular thermal-heat sinks in the world. In this article, we will discuss the application field and working principle of AER19-19-18CB/A01.

Application Field

The AER19-19-18CB/A01 is primarily used for cooling highly sensitive electronics components, including laser diodes, semiconductors, and transistors, as well as other objects such as avionics, automobiles, power supplies, and computers. This thermal-heat sink is also often used in CPU and GPU chipsets, as well as for cooling down hardened storage devices and other sensitive components. This cooling system is designed to evenly distribute heat away from the components, providing effective cooling over long periods of time.

Working Principle

The AER19-19-18CB/A01 works by drawing heat away from the object and dissipating it into the surrounding air. The thermal-heat sink is composed of several layers, with each layer playing an important role in the cooling process. The first layer is the heatsink base, which is in direct contact with the object and helps to draw heat away from it. The second layer is the fins, which are responsible for dissipating the heat away from the object and into the air. The third layer is the fan, which helps to evenly distribute the heat, making sure it is spread away from the object and into the surrounding air. Finally, the fourth layer is the mounts, which are used to attach the heatsink to the object. The AER19-19-18CB/A01 uses natural convection to dissipate the heat from the object. Natural convection occurs when heated air rises away from the object and is replaced with cooler air which helps to reduce the overall temperature of the system. The fan helps to ensure that the heat is evenly distributed away from the object and the surrounding area, while the heatsink fins help to ensure that the air is cooled before it reaches the object again.

Conclusion

AER19-19-18CB/A01 is one of the most popular thermal-heat sinks available, thanks to its reliable and efficient cooling system. Its application field is mainly used for cooling a variety of electronics components and other objects, including avionics, automobiles, power supplies, as well as CPU and GPU chipsets. The thermal-heat sink works by drawing heat away from the object and dissipating the heat into the surrounding air using natural convection, with the help of a fan and heatsink fins. In conclusion, if you are looking for an efficient and reliable thermal-heat sink, then AER19-19-18CB/A01 is a great option.

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