AER31-31-21CB/A01 Allicdata Electronics
Allicdata Part #:

AER31-31-21CB/A01-ND

Manufacturer Part#:

AER31-31-21CB/A01

Price: $ 4.40
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER31-31-21CB/A01 datasheetAER31-31-21CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.95684
Stock 1000Can Ship Immediately
$ 4.4
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 1.205" (30.61mm)
Width: 1.205" (30.61mm)
Diameter: --
Height Off Base (Height of Fin): 0.811" (20.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.62°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.71°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

AER31-31-21CB/A01, otherwise known as thermal-heat sinks, are integrated solutions designed and developed to manage a wide range of thermal management applications. These thermal heat sinks are designed for efficient thermal transfer, optimized cooling, and improved reliability and longevity.

Heat sinks are typically made from a metal, usually aluminum or copper, but other materials can be used such as silicon. AER31-31-21CB/A01 is specifically designed for thermal conductivity and dissipates heat away from a component or device through its large surface area. The material used and the design of the AER31-31-21CB/A01 heat sink allow for effective heat dissipation from the device or component it is attached to, bringing the device or component to its set operating temperature.

thermal-dissipation processes include convection, conduction, radiation, and phase changes. Areas such as space-constrained electronics, battery systems, and mechanical systems can benefit from AER31-31-21CB/A01 heat sink. This is because of its larger surfaces area, high thermal conductivity, and improved reliability.

The working principle of a AER31-31-21CB/A01 heat sink is based on laws of thermodynamics and diffusion of heat. It consists of a wick structure that allows liquid to spread and absorb heat from a hot source. Heat is then conducted through the wick and the walls of the device, causing the temperature around the heat sink to reach its setoperating temperature.

The AER31-31-21CB/A01 heat sink is applied to numerous need industries including automotive, home appliances, lifters, computers, medical equipment, and gaming consoles. It has been designed for high level cooling performance and durability under high temperature influence. It is also highly reliable, ensuring long-term service life.

AER31-31-21CB/A01 is an essential part of many systems as they play a large role in the increasing life and enhancing performance of the system. Its widespread applications make it a useful device in the industry, and a stable, quick, and efficient cooling solution.

The specific data is subject to PDF, and the above content is for reference

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