AER31-31-23CB/A01 Allicdata Electronics
Allicdata Part #:

AER31-31-23CB/A01-ND

Manufacturer Part#:

AER31-31-23CB/A01

Price: $ 4.40
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER31-31-23CB/A01 datasheetAER31-31-23CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.95684
Stock 1000Can Ship Immediately
$ 4.4
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 1.205" (30.61mm)
Width: 1.205" (30.61mm)
Diameter: --
Height Off Base (Height of Fin): 0.890" (22.61mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.42°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.41°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

AER31-31-23CB/A01 thermal solutions help dissipate heat to maintain optimal temperature levels for various electronic devices. It is a type of heat sink, which is an important part of any thermal design, and it is commonly used in computers, smartphones, and other forms of electronic equipment. The heat sink\'s design includes a thermally conductive aluminum base, which helps to direct heat away from the device and dissipate it into the air, allowing the device to remain cool and remain functioning at optimal temperatures.

The design and working principles of the AER31-31-23CB/A01 thermal solutions involve the dissipation of heat by transferring it away from the source, which is the electronic device itself. Heat is generated within the device as its components, such as the processor, work to perform their functions. The heat generated is then conducted through the base of the heat sink, which can be made of various materials, such as copper, aluminum, or even ceramic. Due to its thermal conductive properties, this material helps to quickly and efficiently transfer the heat from the device into the air.

The base of the AER31-31-23CB/A01 thermal solutions works in tandem with an array of fins, which act as additional radiators. These fins are arranged in a specific fashion along the length of the base, allowing them to dissipate the heat with maximum efficiency. This helps to ensure that the heat is dispersed quickly and evenly and also ensures that the heat sink stays relatively cool. Additionally, the fins play the role of increasing the surface area faced by the airflow, which further helps to ensure that the heat is dispersed efficiently and on a large scale.

The fins also play an important role in providing air circulation for the heat sink, as they act in tandem with any fans installed on the device. This helps to ensure that the fins are constantly pushing the heat away from the device at all times, thereby helping to keep the device\'s temperatures at optimal levels at all times. Additionally, the fins also reduce the noise pollution associated with running the device, which can be an issue with traditional cooling solutions.

Finally, AER31-31-23CB/A01 thermal solutions provide efficient heat dissipation and cooling facets for electronics devices, making it a great choice for any electronic device. It offers efficient heat dissipation across a wide area, while remaining relatively quiet and efficient. This makes the AER31-31-23CB/A01 thermal solutions an ideal choice for any electronic device that requires efficient cooling and reliable temperature control in order to function optimally.

The specific data is subject to PDF, and the above content is for reference

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