AGLN250V2-ZVQG100I Allicdata Electronics
Allicdata Part #:

AGLN250V2-ZVQG100I-ND

Manufacturer Part#:

AGLN250V2-ZVQG100I

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 68 I/O 100VQFP
More Detail: N/A
DataSheet: AGLN250V2-ZVQG100I datasheetAGLN250V2-ZVQG100I Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: IGLOO nano
Part Status: Obsolete
Number of Logic Elements/Cells: 6144
Total RAM Bits: 36864
Number of I/O: 68
Number of Gates: 250000
Voltage - Supply: 1.14 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)
Base Part Number: AGLN250
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Field Programmable Gate Array (FPGA) technology is a state-of-the-art application field in embedded computing. AGLN250V2-ZVQG100I is a FPGA device utilizing the latest FPGA technology, delivering the best in embedded application performance. The AGLN250V2-ZVQG100I is an ideal choice for embedded computing applications that require a robust, reliable, and high-performance solution.

AGLN250V2-ZVQG100I features up to 12.8 Mbits of on-chip SRAM and up to 1 GIG of embedded resources for memory storage and high-speed embedded storage. The device also supports DDR3 interface, high-speed serial interconnect, and PCIe 2.0 interface. In addition, the device supports multiple clock domains, including an adjustable system clock frequency that can be up to 720 MHz.

The AGLN250V2-ZVQG100I provides an integrated design environment that enables rapid prototyping and design of complex embedded applications. The device provides flexible and configurable connectivity resources throughout its embedded architecture and supports multiple system-level debugging services.

The AGLN250V2-ZVQG100I includes several features to support fast and reliable operation, such as:

  • On-Chip JTAG for debug
  • High-speed logic re-configurability
  • On-Chip distributed FIFOs for data buffering
  • Low-Power technology for energy efficient operation
  • Total power and clock management system
  • Multiple DMA (Direct Memory Access) channels

The working principle of AGLN250V2-ZVQG100I is that it configures the FPGA circuitry according to the user-supplied circuit design. The design is loaded into the FPGA device. The FPGA then configures its internal circuitry to match the supplied design. The device then operates according to the instructions supplied in the design. The user can configure the device to perform a specific function or a set of functions. This makes the AGLN250V2-ZVQG100I highly scalable and cost-effective.

The key advantage of AGLN250V2-ZVQG100I is its support for high-speed embedded data storage, high-speed serial communication, and high-speed processor cores. This makes the device highly efficient for embedded applications and allows for improved system performance. The device also supports up to 12.8 Mbits of on-chip SRAM, DDR3 interface, and PCIe 2.0 interface for fast and reliable data storage and throughput.

In addition, the device provides advanced low-power technology, adjustable system clock frequency, and multiple clock domains for energy efficient operation. This makes the device perfect for energy-sensitive embedded applications and provides improved power management. The device also supports JTAG debugging, flexible and configurable connectivity resources throughout its embedded architecture, and multiple system-level debugging services.

The AGLN250V2-ZVQG100I FPGA device is the most robust, reliable and high-performance solution for embedded computing applications. The device provides advanced features that enable fast and reliable operation, high-speed embedded data storage, and high-speed processor cores. In addition, the device supports flexible and configurable connectivity resources, adjustable system clock frequency, and multiple clock domains for energy efficient embedded system operation.

The specific data is subject to PDF, and the above content is for reference

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