APF30-30-06CB Allicdata Electronics
Allicdata Part #:

294-1151-ND

Manufacturer Part#:

APF30-30-06CB

Price: $ 4.63
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK LOW-PROFILE FORGED
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APF30-30-06CB datasheetAPF30-30-06CB Datasheet/PDF
Quantity: 123
1 +: $ 4.21470
10 +: $ 4.10256
25 +: $ 3.87500
50 +: $ 3.64694
100 +: $ 3.41901
250 +: $ 3.19108
500 +: $ 2.96314
1000 +: $ 2.90615
Stock 123Can Ship Immediately
$ 4.63
Specifications
Series: APF
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.250" (6.35mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an indispensable component of any electronic device. Heat generated from electronic components must be effectively managed in order to keep them in optimal working condition. The Thermal - Heat Sinks category includes a wide range of products that help keep a device’s temperature in control, including the APF30-30-06CB.

The APF30-30-06CB is a thermally enhanced heat sink designed to provide cooling for electronic components. This particular product features 30mm high fins and a fin area of 95cm2. It also has a built-in fan that can be adjusted to provide the optimal level of cooling. The fan has a maximum speed of 2600 rpm, making it capable of drawing in air at a rate of 8m3/min. Together, the fins and fan provide superior cooling performance while at the same time reducing acoustic noise.

The APF30-30-06CB is extremely efficient due to its innovative, high-performance design. Its heatsink base is manufactured using high-grade aluminum alloy and provides excellent thermal conductivity. The aluminum alloy has a special coating that further increases its heat dissipation capabilities. This coating also serves to protect the heatsink from damage caused by environmental factors, such as dust and corrosion. The fins are made with advanced aerodynamics to further improve cooling efficiency.

The APF30-30-06CB is designed to provide maximum cooling with minimal noise. Its fan is designed to reduce vibration and noise by using a unique bearing structure. This structure helps to ensure that the fan turns properly and efficiently, while keeping noise levels to a minimum. The fan speed can be controlled to provide the right amount of cooling for any individual component.

The APF30-30-06CB has a wide range of applications, including servers, network equipment, storage devices, and other electronic devices. It is a reliable and effective thermal solution for components requiring high amounts of cooling capacity. Furthermore, it is easy to install and allows for quick and efficient thermal management.

In summary, the APF30-30-06CB is a thermally enhanced heat sink designed for efficient cooling of electronic components. Its high-grade aluminum alloy base and aerodynamic fins provide superior cooling capabilities, and its fan can be adjusted to fit any cooling needs. This product is reliable, efficient, and easy to install, making it an ideal thermal solution for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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