APF30-30-13CB

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Thermal management is an important process when dealing with sensitive electronics. Heat sinks are often used to cool these electronics, aiding in the thermal management process. The APF30-30-13CB is one such heat sink designed for these applications.

The APF30-30-13CB is a high-performance heat sink designed for applications requiring cooling solutions. It has a fin stack height of 30mm with 24 fins connected by a single flat bar; 13-well clip and brackets handling the cooling process. When air is passed through the fins, the fin stack serves to dissipate the heat generated by the electronics. The design of the fin stack ensures maximum air flow, thus allowing the heat to be dissipated quickly and efficiently.

The APF30-30-13CB also features an aluminum construction, making it lightweight and durable. The design also includes a natural convection feature, which helps to bolster the thermal cooling performance. This feature ensures that the system remains quiet even during periods of extended usage.

The APF30-30-13CB is designed for use in many different applications. It is primarily used as a cooling solution for telecommunications equipment, such as cell phones, servers, and routers. It can also be used in medical devices, scientific instruments, industrial equipment, and other electronic applications.

The APF30-30-13CB is a highly efficient heat sink. Its maximum thermal performance rating is 108 W/m², which is slightly higher than other heat sinks of similar form factor. This elevated performance rating allows for higher thermal loads to be dissipated while maintaining a relatively low thermal resistance. The lower thermal resistance ensures that the system does not become overloaded with heat.

The working principle of the APF30-30-13CB is quite simple. Heat is generated by the electrical components, such as a CPU or GPU, which is then transferred to the air passing through the fins of the heat sink. The fin stack and brackets act to dissipate the heat away from the components, lowering their temperature and thus preventing them from overheating. The thermal resistance ensures that the temperature does not exceed the safe operating temperature for the components.

The APF30-30-13CB is an excellent solution for thermal management. Its lightweight design, high thermal performance rating, and simple installation make it an ideal choice for any application requiring a reliable and effective cooling solution. With its impressive performance and ease-of-use, it is the perfect heat sink for any application.

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