B1161UCTP Allicdata Electronics
Allicdata Part #:

B1161UCTP-ND

Manufacturer Part#:

B1161UCTP

Price: $ 0.00
Product Category:

Circuit Protection

Manufacturer: Littelfuse Inc.
Short Description: BATTRAX SLIC DUAL NEG 400A MS013
More Detail: N/A
DataSheet: B1161UCTP datasheetB1161UCTP Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Battrax®
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Voltage - Clamping: Adjustable
Technology: Mixed Technology
Number of Circuits: 1
Applications: SLIC
Mounting Type: Surface Mount
Package / Case: 6-SMD, Gull Wing
Supplier Device Package: MS-013
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The B1161UCTP is a mixed technology that facilitates the connection of printed circuit boards (PCB) to peripheral devices, such as an external storage device. It combines the best of both rigid disk and pogo pin technologies to create a reliable, cost-effective system. The B1161UCTP provides a secure connection with a high signal integrity, a small footprint, and fast transmission speeds. Furthermore, the device is able to maintain its performance over a wide temperature range, allowing it to be used in a wide variety of applications.
In order to understand the working principles of the B1161UCTP, it is important to first understand the components that make up the device. The B1161UCTP uses both rigid disk and pogo pin technologies to make connections between PCBs and peripheral devices. The rigid disk technology is used to create a spring-loaded connection between a PCB and a peripheral device, providing a secure and reliable connection. The disk is held in place using a spring-loaded mechanism, which ensures that the connection is consistently secure. The pogo pin technology is then used to create a stronger electrical connection between the PCB and the peripheral device. This is done by inserting small pins into the PCB, which create stronger electrical connections than regular solder joints.
Once the connections have been created, the device is able to transfer data quickly while maintaining a high signal integrity. This is due to the use of two separate layers of plastic insulation, which helps to reduce noise interference. Additionally, the device has a thick layer of shielding to prevent interference from external sources. This means that the device is able to maintain its performance over a wide range of operating conditions, making it suitable for applications in many different environments.
In addition to its reliable connections and fast transmission speeds, the B1161UCTP also offers a specialized mounting system. This system allows for easy installation and removal of the device, which helps to reduce setup time. This helps to reduce costs for the user, as they will not need to purchase separate mounting hardware or tools for installation.
The B1161UCTP is a powerful device that is able to provide a secure connection while also offering an easy installation process. Its combination of rigid disk and pogo pin technologies makes it an ideal choice for many different applications. Furthermore, its impressive signal integrity and efficient performance makes it a cost-effective choice for many different users. The B1161UCTP is a mixed technology device that provides reliable connections and fast data transfer speeds, making it ideal for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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