BDN10-3CB/A01

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a crucial factor when it comes to electrical and mechanical properties of electronic applications. The need for proper thermal management of electronic products is continually increasing due to higher power density, broader operating temperatures and varying environmental conditions. Heat sinks are often used to dissipate the heat produced by electrical components. They are specifically designed to maximize heat dissipation by dissipating heat away from the hot spot and creating an area of lower thermal resistance between the heat source and the ambient environment. The heat sinks used in most electronics applications are usually composed of aluminum or copper, and are available in a variety of designs and sizes.

BDN10-3CB/A01 is a thermal management heat sink designed for electronic applications. The device is specifically designed to provide optimal heat dissipation and to ensure reliable performance in high power applications. It features a unique "L-shaped" design with a large rectangular base that is designed to dissipate heat quickly and evenly. The device also features advanced dissipator fins with a large thermal mass that increases the rate of heat dissipation, and a thermal tunnel that further reduces the resistance between the device and the surrounding environment.

The key to the effectiveness of the BDN10-3CB/A01 is its working principle. It uses a combination of convection and conduction to dissipate the heat from the surface of the device to the surrounding environment. The large thermal mass of the dissipator fins and the thermal tunnel work together to reduce the resistance of the heat transfer. Furthermore, the L-shaped design allows a large area of the heat source to be exposed to the environment, thus improving the efficiency of the thermal management. Moreover, the design of the device allows it to be mounted very close to the heat source, ensuring efficient heat transfer.

The BDN10-3CB/A01 thermal management heat sink can be used in a wide variety of applications such as telecommunication systems, data centers, computers, and medical devices. It is capable of operating at temperatures from -40°C up to +100°C, and is designed to perform in harsh and extreme environments. Furthermore, it is compliant with various safety standards and is also RoHS compliant.

The BDN10-3CB/A01 thermal management heat sink is an ideal solution for cooling electronic devices. Its advanced design, excellent thermal performance and reliable operation make it an ideal choice for any application requiring effective heat management. It is also a cost-effective solution, and is easily installed and maintained. In summary, the BDN10-3CB/A01 is the perfect solution for problems related to the thermal management of electronic devices.

The specific data is subject to PDF, and the above content is for reference