BDN17-3CB/A01

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are an important part of the power source for a variety of electronic devices and machines. They play an essential role in regulating and maintaining the function and performance of components and systems. The BDN17-3CB/A01 is a type of thermal-heat sink specifically designed to provide efficient and reliable thermal management.

The BDN17-3CB/A01 is a thermally-conductive, passive heat sink designed to absorb and dissipate heat from electronic components. It features a unique, triple-fin design that provides increased surface area for maximum heat dissipation to keep the system cool as well as improved air circulation for better component efficiency. The BDN17-3CB/A01 is made of aluminum material, making it lightweight and easy to install. The design also features a highly conductive thermal silicone-based grease to ensure the best possible transfer of heat away from the components.

The BDN17-3CB/A01 provides optimal heat transfer and is ideal for a wide range of applications. It can be used on CPUs, GPUs, memory chips, power supply units, power amplifiers, power transistors, and other electronic components. The heat sink is typically used in consumer electronics, telecommunications, industrial equipment, automotive, and aerospace industries. It is also suitable for compact or enclosed spaces where a regular fan would be too loud or impractical to install.

The working principle of the BDN17-3CB/A01 is heat conduction. Heat transfers from the component to the heat sink through a thermally-conductive grease. The heat is then dissipated by convection, where the triple-fin design maximizes the air circulation around the heat sink. The included thermal-silicone based grease further aids heat transfer by ensuring that the interface between component and heat sink is not the source of any stalling. This provides an efficient heat dissipation system, ensuring maximum performance.

The BDN17-3CB/A01 thermal-heat sink offers effective heat dissipation and is designed to provide efficient and reliable thermal management. It is a simple and cost-effective solution for anyone who needs an efficient cooling system for their electronic components. The unique triple-fin design provides increased surface area for maximum heat dissipation, while the thermal silicone-based grease ensures maximum heat transfer.

The specific data is subject to PDF, and the above content is for reference