BR24G16-3

Series:	--
Packaging:	Tube
Part Status:	Not For New Designs
Memory Type:	Non-Volatile
Memory Format:	EEPROM
Technology:	EEPROM
Memory Size:	16Kb (2K x 8)
Clock Frequency:	400kHz
Write Cycle Time - Word, Page:	5ms
Memory Interface:	I²C
Voltage - Supply:	1.6 V ~ 5.5 V
Operating Temperature:	-40°C ~ 85°C (TA)
Mounting Type:	Through Hole
Package / Case:	8-DIP (0.300", 7.62mm)
Supplier Device Package:	8-DIP-T

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MemoryThe BR24G16-3 memory is a dynamic RAM module developed by ROHM, a Japanese electronic component manufacturing company. It is based on a high-performance embedded DRAM structure, which combines a bank architecture, fine pitch topology, and high-speed data transfer. This product is suitable for system designs that require high-speed performance, low power consumption, and low latency. This product is well-suited for a variety of applications in the automotive and aerospace markets, including embedded automotive ECUs (electronic control units), medical diagnostic equipment, and other mission-critical systems that require high reliability.BR24G16-3 memory is constructed from several specific core components. The Array Core is the heart of the memory, which is responsible for dynamically storing and error-correcting user data. This core component is divided into SRAM (static random access memory) and DRAM (dynamic random access memory) segments for faster storage of data. The SRAM segment is where the data is initially stored and read, while the DRAM segment is used to maintain data integrity. The core component also includes an Error Correction Code (ECC) engine that can detect and correct errors in stored data.The Memory Interface component contains the interface logic used to transfer data between the device and a host application. This component is composed of the Memory Control Unit (MCU), Address Counter (AC) and the Memory Bus. The MCU is used to control the flow of data between the device and the AC, while the Address Counter is responsible for generating the address for accessing the data stored in the device. The Memory Bus allows the device to communicate with other peripheral devices of the system.The Data Input/Output (DIO) component is responsible for handling the actual data transfers between the MCU, AC and Memory Bus. This component contains the Serial Access Memory (SAM) controller, which is used to control the input/output of data to/from the memory unit. The SAM controller is also responsible for the timing and buffering of data, ensuring that data integrity and consistency are maintained.The clock generator is responsible for providing the necessary clock signals to the internal components of the memory device, ensuring a reliable and stable operation. The clock generator produces two different types of clock signals, one for the SRAM segment, and one for the DRAM segment.The BR24G16-3 memory module is designed to provide a reliable, high-performance memory solution for embedded systems applications. The combination of its high-speed data transfer, low power consumption and low latency make this product ideal for a variety of automotive, medical and aerospace applications. The module also integrates an error correction code (ECC) engine to ensure data integrity, reliability and accuracy. Its compact design makes it well-suited for a variety of embedded system designs. With its superior performance and reliability, the BR24G16-3 memory module is an ideal choice for any application requiring high speed, low latency and low power consumption.

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