
BR25G128FJ-3GE2 Integrated Circuits (ICs) |
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Allicdata Part #: | BR25G128FJ-3GE2TR-ND |
Manufacturer Part#: |
BR25G128FJ-3GE2 |
Price: | $ 0.22 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | ROHM Semiconductor |
Short Description: | SPI BUS EEPROM |
More Detail: | EEPROM Memory IC 128Kb (16K x 8) SPI 20MHz 8-SOP-... |
DataSheet: | ![]() |
Quantity: | 1000 |
2500 +: | $ 0.20105 |
5000 +: | $ 0.18469 |
12500 +: | $ 0.18148 |
25000 +: | $ 0.17718 |
Series: | -- |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Memory Type: | Non-Volatile |
Memory Format: | EEPROM |
Technology: | EEPROM |
Memory Size: | 128Kb (16K x 8) |
Clock Frequency: | 20MHz |
Write Cycle Time - Word, Page: | 5ms |
Memory Interface: | SPI |
Voltage - Supply: | 1.6 V ~ 5.5 V |
Operating Temperature: | -40°C ~ 85°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package: | 8-SOP-J |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
BR25G128FJ-3GE2 is one of the memory products manufactured by Infineon Technologies AG, a world-renowned semiconductor manufacturer. BR25G128FJ-3GE2 is used in a variety of electronic devices, such as digital cameras, video cameras, personal computers, mobile phones, and so on. It is commonly used in high-speed RAM, Flash memory, and embedded system products.
Application Fields of BR25G128FJ-3GE2
The BR25G128FJ-3GE2 is ideal for applications that require low power and low latency. This memory device can improve the performance of embedded system products by providing maximum bandwidth and reducing power consumption. It is also suitable for high-performance applications such as digital signal processing, computer visualization, and multimedia processing. BR25G128FJ-3GE2 is also popular for its high-efficiency, as it can save up to 50% of power compared to other similar products. Furthermore, it is also compatible with various operating systems, making it a versatile choice.
Working Principle of BR25G128FJ-3GE2
BR25G128FJ-3GE2 Memory uses 3-2-1 topology, which is based on the data density, power consumption, control features, and access time. The 3-2-1 topology structure is composed of three layer architectures, each layer consisting of banks, cycles, and blocks. The first layer is the Bank layer which is responsible for storing data in the memory. The second layer is the Cycle layer which is responsible for controlling all the operations and accesses to the data in the memory. The third layer is the Block layer which is responsible for addressing each block in the memory and retrieving the data from it. The 3-2-1 topology of the BR25G128FJ-3GE2 Memory takes advantage of the extremely low power consumption, high speed, and high reliability available in modern DRAM chip technologies.
Conclusion
BR25G128FJ-3GE2 memory is an excellent choice for embedded systems and high-performance applications. Its 3-2-1 topology enable it to provide maximum bandwidth and reduce power consumption, which makes it a great choice for environments where power saving is a key concern. Its compatibility with various operating systems also makes it a versatile choice. Therefore, it is no surprise that BR25G128FJ-3GE2 memory is quickly becoming a favorite for those who need reliable performance and low power consumption.
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