BR25G128FJ-3GE2 Allicdata Electronics

BR25G128FJ-3GE2 Integrated Circuits (ICs)

Allicdata Part #:

BR25G128FJ-3GE2TR-ND

Manufacturer Part#:

BR25G128FJ-3GE2

Price: $ 0.22
Product Category:

Integrated Circuits (ICs)

Manufacturer: ROHM Semiconductor
Short Description: SPI BUS EEPROM
More Detail: EEPROM Memory IC 128Kb (16K x 8) SPI 20MHz 8-SOP-...
DataSheet: BR25G128FJ-3GE2 datasheetBR25G128FJ-3GE2 Datasheet/PDF
Quantity: 1000
2500 +: $ 0.20105
5000 +: $ 0.18469
12500 +: $ 0.18148
25000 +: $ 0.17718
Stock 1000Can Ship Immediately
$ 0.22
Specifications
Series: --
Packaging: Tape & Reel (TR) 
Part Status: Active
Memory Type: Non-Volatile
Memory Format: EEPROM
Technology: EEPROM
Memory Size: 128Kb (16K x 8)
Clock Frequency: 20MHz
Write Cycle Time - Word, Page: 5ms
Memory Interface: SPI
Voltage - Supply: 1.6 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOP-J
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

BR25G128FJ-3GE2 is one of the memory products manufactured by Infineon Technologies AG, a world-renowned semiconductor manufacturer. BR25G128FJ-3GE2 is used in a variety of electronic devices, such as digital cameras, video cameras, personal computers, mobile phones, and so on. It is commonly used in high-speed RAM, Flash memory, and embedded system products.

Application Fields of BR25G128FJ-3GE2

The BR25G128FJ-3GE2 is ideal for applications that require low power and low latency. This memory device can improve the performance of embedded system products by providing maximum bandwidth and reducing power consumption. It is also suitable for high-performance applications such as digital signal processing, computer visualization, and multimedia processing. BR25G128FJ-3GE2 is also popular for its high-efficiency, as it can save up to 50% of power compared to other similar products. Furthermore, it is also compatible with various operating systems, making it a versatile choice.

Working Principle of BR25G128FJ-3GE2

BR25G128FJ-3GE2 Memory uses 3-2-1 topology, which is based on the data density, power consumption, control features, and access time. The 3-2-1 topology structure is composed of three layer architectures, each layer consisting of banks, cycles, and blocks. The first layer is the Bank layer which is responsible for storing data in the memory. The second layer is the Cycle layer which is responsible for controlling all the operations and accesses to the data in the memory. The third layer is the Block layer which is responsible for addressing each block in the memory and retrieving the data from it. The 3-2-1 topology of the BR25G128FJ-3GE2 Memory takes advantage of the extremely low power consumption, high speed, and high reliability available in modern DRAM chip technologies.

Conclusion

BR25G128FJ-3GE2 memory is an excellent choice for embedded systems and high-performance applications. Its 3-2-1 topology enable it to provide maximum bandwidth and reduce power consumption, which makes it a great choice for environments where power saving is a key concern. Its compatibility with various operating systems also makes it a versatile choice. Therefore, it is no surprise that BR25G128FJ-3GE2 memory is quickly becoming a favorite for those who need reliable performance and low power consumption.

The specific data is subject to PDF, and the above content is for reference

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