| Allicdata Part #: | BR25G1MF-3GE2TR-ND |
| Manufacturer Part#: |
BR25G1MF-3GE2 |
| Price: | $ 1.09 |
| Product Category: | Integrated Circuits (ICs) |
| Manufacturer: | ROHM Semiconductor |
| Short Description: | IC EEPROM 1M SPI 10MHZ 8SOP |
| More Detail: | EEPROM Memory IC 1Mb (128K x 8) SPI 10MHz 8-SOP |
| DataSheet: | BR25G1MF-3GE2 Datasheet/PDF |
| Quantity: | 2500 |
| 2500 +: | $ 0.98169 |
| Series: | -- |
| Packaging: | Tape & Reel (TR) |
| Part Status: | Active |
| Memory Type: | Non-Volatile |
| Memory Format: | EEPROM |
| Technology: | EEPROM |
| Memory Size: | 1Mb (128K x 8) |
| Clock Frequency: | 10MHz |
| Write Cycle Time - Word, Page: | 5ms |
| Memory Interface: | SPI |
| Voltage - Supply: | 1.8 V ~ 5.5 V |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Mounting Type: | Surface Mount |
| Package / Case: | 8-SOIC (0.173", 4.40mm Width) |
| Supplier Device Package: | 8-SOP |
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:BR25G1MF-3GE2 is a type of DRAM memory module, specifically designed for desktop and server computers. It is a type of memory module that can store and access large amounts of data quickly and reliably. The main features and applications of the BR25G1MF-3GE2 include:
Application Field
The BR25G1MF-3GE2 can be used in a wide variety of desktop and server computers, including gaming PCs and servers in enterprise networks. It is also used in high-end workstations, such as video editing systems. Additionally, it can also be used in embedded system applications, such as medical and industrial control systems.
Working Principle
The BR25G1MF-3GE2 utilizes an architecture known as Non-Volatile DRAM, or NVDM, which allows the module to store data even when the system is not in use. This is done by utilizing a backup power source to maintain power to the module. As a result, the data stored in the module is retained and all changes are updated on a regular basis. This allows for greater reliability and eliminates the need for frequent data backups.The BR25G1MF-3GE2 also utilizes Error Correction Code (ECC) data protection, which eliminates or reduces the effects of data corruption and ensures that data is transferred reliably and accurately.
The BR25G1MF-3GE2 also offers advanced features such as Multi-lane Data Rates (MDR), DDR3 SDRAM interface support, and Integrated L2 Cache. The MDR feature allows data to be transferred at higher speeds, while the DDR3 SDRAM support ensures high-speed data access. Furthermore, the integrated L2 Cache improves the performance of the DRAM module by providing high-speed access to data, allowing for faster data retrieval.
In addition, the BR25G1MF-3GE2 has thermal management and power management capabilities, which keep the chip from overheating and ensure power efficiency. The thermal management feature helps keep the DRAM at a constant temperature, while the power management feature helps reduce the power consumption of the module, thereby increasing its energy efficiency.
Overall, the BR25G1MF-3GE2 is a highly reliable, high-performance DRAM memory module that can be used in a variety of applications. It offers advanced features, such as Non-Volatile DRAM, Multi-lane Data Rates, DDR3 SDRAM interface support, and Integrated L2 Cache, to ensure fast, reliable data access and storage. Additionally, the thermal and power management capabilities ensure that the DRAM module operates efficiently and keeps the system running smoothly.
The specific data is subject to PDF, and the above content is for reference
| Part Number | Manufacturer | Price | Quantity | Description |
|---|
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| BR250-320B2-28V-006 | Microsemi Co... | 0.0 $ | 1000 | RELAYRelay Coil |
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| BR250D-320C2-28V-020 | Microsemi Co... | 0.0 $ | 1000 | RELAYRelay Coil |
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BR25G1MF-3GE2 Datasheet/PDF