CC2564BYFVR-XI

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RF Transceiver ICs

CC2564BYFVR-XI is a system-in-package (SiP) integrated circuit (IC) device designed specifically for low power and medium-range Bluetooth communication applications. It is part of the X-Chip portfolio, which includes other low-power Bluetooth Smart products such as the CC2562F device. The CC2564BYFVR-XI handles up to four physical layer (PHY) connections, providing a highly integrated solution with verified Bluetooth specifications.

The CC2564BYFVR-XI "smart" IC controls all aspects of Bluetooth communication, making it ideal for use in any system where there is a need for a low-power, robust wireless data or streaming audio connection. Applications range from consumer electronics and medical devices to home automation and industrial process control. It is designed to simplify Bluetooth development with its integrated mesh networking capabilities, software-controlled baseband stacks, and onboard RF transceiver for transmission and reception.

The CC2564BYFVR-XI RF transceiver IC serves as a physical layer for data transmission and reception in Bluetooth applications. A dedicated antenna port enables direct access to the RF chain, allowing the transceiver to receive radio frequency (RF) signals over a small range. At the same time, the onboard RF transceiver allows for transmission of RF signals, ranging from a few meters to around one hundred meters in free space. This allows for powering up and exchanging data at any range, with minimal interference and enhanced performance.

The CC2564BYFVR-XI RF transceiver includes a processor core, a digital baseband audio system, and a power management unit (PMU). The processor core allows for execution of firmware programs, such as application code, stack configuration, or special event handling. The audio monitoring system processes audio from incoming communication streams and converts them into analog signals that can be sent to compatible devices. The PMU manages and distributes the power supply to different components, such as the RF transceiver, so that it does not exceed the operating voltage range of the device.

The CC2564BYFVR-XI RF transceiver is highly configurable and is capable of supporting optional features, such as low-cost serial port (LSP) and advanced digital signal processor (DSP) to support on-the-fly data format conversions and data transfer. In addition, the device includes a variety of analog and digital components, such as analog-to-digital converters (ADC) and digital-to-analog converters (DAC). These components are combined to produce a comprehensive solution that is capable of achieving low power consumption, low noise, and low latency.

The CC2564BYFVR-XI RF transceiver IC is designed to provide applications with a low-power, medium-range Bluetooth solution. It is suitable for numerous applications, including consumer electronics, medical devices, and industrial process control. While the device can stream audio, it is capable of supporting bidirectional data exchange and remote device pairing. In addition, the CC2564BYFVR-XI has verified Bluetooth specifications and on-the-fly data format conversions and data transfer capabilities. With its advanced feature set and robust design, it is a great choice for any low-power Bluetooth application.

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