CP30239H

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CP30239H thermoelectric modules are designed to provide simple and reliable solutions for cooling and heating electronic components. It is commonly used in environmental testing chambers, medical equipment, welding equipment, power supplies, HVAC systems, aerospace technology and printing equipment. It is also used in various consumer products.

The CP30239H thermoelectric module utilizes the Peltier Effect, where an electrical current flowing through a junction of two dissimilar materials creates a thermal gradient across the junction due to a transfer of heat. When the electrical current passes through the metallurgical junction, one side of the junction is heated while the other side is cooled.

In terms of its working principle, the CP30239H thermoelectric module is designed to work by creating heat transfer in one direction. When current is applied through the device, the temperature of the heat sink side is decreased while the temperature of the hot side is increased. Ultimately, this causes the entire unit to cool or heat up.

The design of the module consists of two ceramic substrates, on top of which a pattern of thermally conductive paste is applied. The substrates are then connected with a string of layers of metal film. In addition, the hot side is equipped with a thermal conductor which are connected to the power source, while the heat sink side consists of a thermally conductive copper plate for efficient heat dissipation.

The CP30239H thermoelectric module also features a safety circuit, which prevents over-temperature of the hot side, thus ensuring the safety of the device in case of an overload. With its ultra-high power density and reliable performance, the CP30239H module is an ideal choice for cooling and heating applications.

In conclusion, the CP30239H thermal module is a highly efficient device designed to provide simple and reliable solutions for cooling and heating electronic components. Its design combines a Peltier effect, two ceramic substrates, metal layers, and a thermal conductor to create a device with an ultra-high power density that is capable of cooling or heating the device with reliable performance. This makes it an ideal component for a variety of applications.

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