CYD18S72V18-167BGXC Datasheet/PDFCYD18S72V18-167BGXC is a memory product produced by CY, which belongs to the DDR3L SDRAM, or low-power DDR3 SDRAM, memory category. This multifunctional memory part has a range of applications in computers and other computing devices, due to its low power consumption, high performance and low pin count.
The CYD18S72V18-167BGXC memory utilizes double data rate type three synchronous dynamic random access memory (DDR3 SDRAM) technology. This technology improves the overall performance of the memory by using a double data rate architecture which transfers data on both the rising and falling edges of the clock signal from the memory controller. The enhanced features of DDR3 SDRAM, compared with its predecessors DDR2 SDRAM and DDR SDRAM, include lower power consumption, higher performance and lower pin count.
The CYD18S72V18-167BGXC has an 8 bit bus and can operate at up to 1.35 volts. It comes in a standard 72-ball BGA package and has a speed of 166MHz. The memory can operate at a temperature between 0 and 95 degrees Celsius and is also capable of operating in both registered and non-registered mode. It is RoHS compliant, supports error-correcting code (ECC) and has a refresh rate of 15.625 us/15.625 us.
When configuring the memory, it is important to take into consideration the type of system and the size of the application the memory will be used for. As an example, a larger application such as a database server may require more address space, which will require the use of a higher density memory. Similarly, for a system with more simultaneous requests, such as a large web server, a higher speed memory will be more suitable as this will ensure faster response times for the user.
The main purpose of the CYD18S72V18-167BGXC is to provide high speed storage and access to data in computer systems. It achieves this by utilizing DDR3 SDRAM technology to transfer data via a double data rate architecture which works on both rising and falling clock signals. It is also low power and RoHS compliant, making it a suitable memory module for multiple applications.