CYDM064B08-55BVXI

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CYDM064B08-55BVXI is a 6-Megabit Static Random Access Memory (SRAM). It is a semiconductor class of integrated circuit and is typically used as primary memory which carries out the instruction and programs that a computer uses. It provides the material data referenced by application programs and is also used for temporary storage during arithmetic operations.

The core component of CYDM064B08-55BVXI is a single 256K CMOS Static Random Access Memory (SRAM) array. It offers a high density of 36M-bits of storage at a low power of 80mA for SRAM operation. Other features include faster access times, low operating voltages, and a higher speed than most traditional SRAMs.

CYDM064B08-55BVXI has numerous applications in many areas including embedded systems, industrial automation, and networking. It can be used as primary memory in embedded systems due to its fast data access and small footprint, making it ideal for cost-sensitive applications. It can also be used to store critical device or system data in industrial automation applications due to its fast access times and superior robustness. Moreover, CYDM064B08-55BVXI is well suited for networking applications due to its low power requirements and scalability.

The working principle of CYDM064B08-55BVXI consists of four functional parts: address decoding, sense amplifiers, 0.36μm CMOS circuitry and address decoding. All of these components are found within a single 276-pin CSP package and are designed to optimize the read/write performance of the device. It has a data bus width of 8-bits, allowing data to be written or read from the device in 8-bit chunks at a time. It also has an address bus width of 22-bits, allowing up to four million distinct memory locations to be addressed.

CYDM064B08-55BVXI is a highly reliable and cost-effective memory solution for a wide range of applications. Its high density, low power consumption and fast access times make it an ideal choice for a variety of tasks including embedded systems, industrial automation and networking. Furthermore, its scalability, wide range of package sizes and compatibility with industry standard architectures make it a very attractive memory solution for many applications.

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