DSPIC33EP512GP504T-I/TL Allicdata Electronics
Allicdata Part #:

DSPIC33EP512GP504T-I/TL-ND

Manufacturer Part#:

DSPIC33EP512GP504T-I/TL

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microchip Technology
Short Description: IC MCU 16BIT 512KB FLASH 44VTLA
More Detail: dsPIC dsPIC™ 33EP Microcontroller IC 16-Bit 70 MIP...
DataSheet: DSPIC33EP512GP504T-I/TL datasheetDSPIC33EP512GP504T-I/TL Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Program Memory Type: FLASH
Base Part Number: DSPIC33EP512GP504
Supplier Device Package: 44-VTLA (6x6)
Package / Case: 44-VFTLA Exposed Pad
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Data Converters: A/D 9x10b/12b
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
RAM Size: 24K x 16
EEPROM Size: --
Series: dsPIC™ 33EP
Program Memory Size: 512KB (170K x 24)
Number of I/O: 35
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
Speed: 70 MIPs
Core Size: 16-Bit
Core Processor: dsPIC
Part Status: Active
Packaging: Tape & Reel (TR) 
Description

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The DSPIC33EP512GP504T-I/TL is a microcontroller (MCU) created by Microchip Technology Inc. Microchip is a leader in the embedded MCU world, and their products are often chosen by engineers when developing embedded solutions. The DSPIC33EP512GP504T-I/TL is one of the most noticeable MCUs in the embedded world because its many advantages, such as its low power consumption, wide range of integrated peripherals, and an extensive instruction set.

The MCU is based on the dsPIC33E architecture and incorporates a large number of references in its design. The MCU is also provided with 512KB of program memory and 48KB of internal data memory. The device supports up to sixteen 16-bit timer modules, five 16-bit pulse-width-modulation (PWM) pairs, advanced motor control, along with dual analog-to-digital (A/D) converters and up to 12-bit resolution for up to 8-channels.

This device is optimized for applications requiring fast execution, high integration, and low-power operation such as consumer, industrial, and automotive duties. The underlying dsPIC33E architecture enables up to 3 times higher performance compared to the previous dsPIC33F platform while maintaining the same low-power profile. The clock speeds are also improved and now offer up to 40MHz of energetic efficiency.

The MCU is powered by a three-stage pipeline structure composed of a fetch unit, decode unit, and execution unit. This configuration allows instructions to be processed in the background while instructions are being fetched, increasing overall execution power. The core also supports stack read and write instructions that provide a simple and efficient way to handle multiple tasks in parallel.

The core of this device also supports the assembly instruction set, allowing developers to write code directly in assembler to maximize control. This feature is combined with an advanced data manipulation unit that includes multiplication and division instructions, as well as complement and rotate instructions for bit operations.

The DSPIC33EP512GP504T-I/TL also includes many modules dedicated to the control of special features. The digital signal processing capabilities of the device can be used for further customizing the design and include a fast on-chip analog-to-digital (A/D) converter, a sigma-delta module as well as a phase-locked-loop with advanced capabilities.

The device also provides multiple outputs to drive on-board peripheral devices and supports up to sixteen 16-bit timer modules with five 16-bit PWM pairs that can be used for pulse-width modulation. This level of control makes it suitable for a variety of complex applications, such as motor control, active and passive filtering, gate control, and more.

Finally, the device integrates several communication methods. This includes an I2C, SPI and USART interface, real-time clock (RTC) for calendar and timer function, and numerous analog and digital peripheral interfaces. These features combine to create a powerful and versatile MCU that can be used for a variety of embedded applications.

The specific data is subject to PDF, and the above content is for reference

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