DZ23B6V8-HE3-08

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The DZ23B6V8-HE3-08 is a monolithic array of two, 3.6-volt, 500mW Zener diodes in the SOT223 (SC-89) package. This device has two separate diodes and is optimized for very low thermal resistance.

DZ23B6V8-HE3-08 Zener diode arrays are mainly used as signal level shifters, voltage references, over-voltage protection circuits, and voltage clamping circuits. This device features a wide operating junction temperature range, low reverse leakage current and excellent Zener impedance.

The basic working principle of a Zener diode array is a combination of a diode\'s forward and reverse biasing. When an external voltage is applied in the reverse direction, the diode will not be affected as long as the applied voltage is lower than the threshold voltage, known as the Zener voltage (Vz). Once this voltage exceeds the Zener voltage, the reverse bias voltage will start to increase and the current flowing through the diode will also increase. As the voltage increases beyond this threshold voltage, the current flowing through the diode will start to stabilize. This current is known as the Zener current.

Once the Zener current has been established, the diode array will remain in a steady-state condition where the current is constant despite the increasing voltage from the external source. In this state, the diode array acts like a reliable voltage reference and provides a constant voltage output as long as the input is kept constant.

The DZ23B6V8-HE3-08 Zener diode array is designed with a wide operating junction temperature range and the low reverse leakage current ensures that the circuit remains stable and the voltage is maintained in the right range. This device is useful in a wide range of applications such as over-voltage protection circuits and voltage clamping circuits.

To sum up, the DZ23B6V8-HE3-08 Zener diode array is an easy-to-use device that can provide excellent protection and reliable voltage reference in a wide range of applications. It is highly-reliable and its low thermal resistance ensures that the device will remain stable even when exposed to a wide range of thermal conditions.

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