EP2AGX125EF29C6G

Series:	Arria II GX
Part Status:	Active
Number of LABs/CLBs:	4964
Number of Logic Elements/Cells:	118143
Total RAM Bits:	8315904
Number of I/O:	372
Voltage - Supply:	0.87 V ~ 0.93 V
Mounting Type:	Surface Mount
Operating Temperature:	0°C ~ 85°C (TJ)
Package / Case:	780-BBGA, FCBGA
Supplier Device Package:	780-FBGA (29x29)

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The EP2AGX125EF29C6G is a high performance, low-power, high-density reconfigurable embedded FPGA solution designed for challenging applications. It offers an unparalleled combination of ultra-low power, high-density logic, low-speed peripherals, high-speed I/O, and flexibility, while delivering superior system performance.The EP2AGX125EF29C6G is a versatile device suitable for a wide range of applications such as portable communication systems, digital signal processors, ultra-low power applications, automotive, networking and industrial control. Additionally, it comprises of the following functional blocks-• Logic Cells• IO Banks• Embedded Memory• Internal BusThe Logic Cells are the heart of the EP2AGX125EF29C6G and provide high performance, low-power logic. The logic cells have configurable synchronous and asynchronous setup and hold timings, programmable output and logic delay, ability to store asynchronous logic sets, configurable port capabilities, power-down logic option and more. The logic cells are designed for easy integration with system-level components, providing optimal control and communication between components.The IO Banks provide the connectivity for the EP2AGX125EF29C6G and offer higher speed, lower power, and higher densities than competitors. Each bank is comprised of several configurable IO pads, and each is capable of being configured as input, output, bidirectional, active low, and active high. The IO banks also feature selectable slew rates, low-voltage outputs, I/O level shifters and support for LVDS, LVCMOS and SSTL (Stretched-Straight-Thru-Lines) protocols.The embedded memory blocks enable faster system operation, superior system design and integration, by allowing the device to reduce external components and to provide efficient on-chip communication. The embedded memory block consists of data RAM, instruction RAM and configuration memory, which provide internal and external memory access and offer features such as dual port RAM, true dual port RAM, ROM and ROM with ECC.The Internal Bus provides a high bandwidth on-chip communication bus for all the internal components, allowing for fast and efficient communication between the device and all system components. The bus supports multiple protocols, such as AXI, AHB, and APB, as well as custom protocols.The EP2AGX125EF29C6G is a versatile device suitable for a wide range of applications. Its combination of low-power, high-density logic, low-speed peripherals, high-speed I/O, and flexibility, make it ideally suited for applications like portable communication systems, digital signal processors, ultra-low power applications, networking and industrial control. Additionally, its IO banks provide a wide selection of input and output capabilities, making them well suited for demanding applications. Its embedded memory blocks provide on-chip access to memory, eliminating the need for external memory devices and speeding up memory access. Finally, its internal bus allows for high-speed communication, enabling quick and efficient communication between all system components and the device. The EP2AGX125EF29C6G is a high performance, low-power, high-density FPGA solution that offers multiple advantages for embedded applications.

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