EP2S60F672C3N Allicdata Electronics
Allicdata Part #:

544-1912-ND

Manufacturer Part#:

EP2S60F672C3N

Price: $ 0.69
Product Category:

Integrated Circuits (ICs)

Manufacturer: Intel FPGAs/Altera
Short Description: IC FPGA 492 I/O 672FBGA
More Detail: N/A
DataSheet: EP2S60F672C3N datasheetEP2S60F672C3N Datasheet/PDF
Quantity: 1000
40 +: $ 0.63000
Stock 1000Can Ship Immediately
$ 0.69
Specifications
Series: Stratix® II
Part Status: Active
Number of LABs/CLBs: 3022
Number of Logic Elements/Cells: 60440
Total RAM Bits: 2544192
Number of I/O: 492
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)
Base Part Number: EP2S60
Description

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Field Programmable Gate Array (FPGA) is an integrated circuit designed to be able to be programmed to perform a specific task or functions. As such, FPGAs are the most popular choice of Integrated Circuits (ICs) in various fields and applications. The FPGA model EP2S60F672C3N, also known as Ivy Bridge, is a current model designed and manufactured by Altera Corporation. It is a powerful and feature-rich FPGA with many desirable features, including high-performance capabilities, energy efficiency and cost effectiveness.

The EP2S60F672C3N FPGA is an optimized range of the Stratix II series and is typically used for complex logic designs such as processor-based systems and DSP-based systems. This model is capable of addressing any signal processing requirement like image processing, audio processing, and digital signal processing (DSP). It also provides a rich set of functions including I/O interfaces, memory interface, analog-to-digital conversion and a range of other features.

The EP2S60F672C3N FPGA is composed of the hard intellectual property cores, the embedded-processor cores, and the system integration modules. The hard Intellectual Property core consists of the Avalon-MM, system-controller, Nios-II-Lite and the Data Synchronizer. The embedded-processor core consists of the Nios-II processor and the Data Synchronizer. The System Integration Modules provide the interfaces between the cores and external shells.

The most important feature of this FPGA model is its ability to provide high performance at low power and cost. The architecture of the EP2S60F672C3N FPGA combines fast logic, DSP blocks and high-density embedded RAM blocks which, when combined, provide for a high performance. This device also features sophisticated power management features that enable the device to be tuned to optimize power and minimize current consumption. In addition, it consumes less power than similar rival FPGAs.

The EP2S60F672C3N FPGA operates by a process known as reconfiguration. The reconfiguration process is achieved by loading the logic templates in the device. The logic functions of the device are determined by these templates. When the logic templates change, the logic functions of the device change accordingly to that. The logic templates are loaded onto the FPGA using the flash memory technology.

The EP2S60F672C3N FPGA has an operating temperature range of -40°C to +125°C and requires a 2.5V power supply. This FPGA model is typically used in various fields and applications such as consumer electronics, medical electronics, automotive systems, networking, industrial automation, and communications. It is frequently found in applications like 3-D printing, robotics, Intelligent Traffic Systems (ITS), and unmanned aerial vehicles (UAVs).

In conclusion, the EP2S60F672C3N FPGA is a powerful, feature-rich and cost-effective FPGA packed with features like high performance, flexibility, and energy efficiency. It is perfect for complex logic designs, especially processor-based systems, DSP-based systems, and image/audio/digital signal processing. It is also an ideal integrated circuit for consumer electronic, automotive, industrial, and communication applications.

The specific data is subject to PDF, and the above content is for reference

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