EP3SL110F780I3N

Series:	Stratix® III L
Part Status:	Active
Number of LABs/CLBs:	4300
Number of Logic Elements/Cells:	107500
Total RAM Bits:	4992000
Number of I/O:	488
Voltage - Supply:	0.86 V ~ 1.15 V
Mounting Type:	Surface Mount
Operating Temperature:	-40°C ~ 100°C (TJ)
Package / Case:	780-BBGA, FCBGA
Supplier Device Package:	780-FBGA (29x29)
Base Part Number:	EP3SL110

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Introduction

The EP3SL110F780I3N is a Field Programmable Gate Array (FPGA) device embedded for use in a range of applications including industrial, automotive, communications, aerospace, and medical imaging. It is specifically designed for implementations where high speed, low power consumption, and low latency are paramount. It features 5.4 million logic elements, 1.6 million slices containing 14,400 Kbits of embedded RAM, and two high-performance Multi-Gigabit Transceivers (MGTs). With the benefits of an FPGA, the EP3SL110F780I3N can be configured according to a customer’s specific needs and its flexibility allows it to be dynamically reconfigured in the field. This article will discuss the application field and working principle of the EP3SL110F780I3N FPGA.

Application Field

The EP3SL110F780I3N FPGA is designed to be used in a variety of applications, including industrial, automotive, communications, aerospace, and medical imaging. Industrial applications include automation and control, as well as machine vision and robotics. Automotive applications include automotive body controllers, vehicle tracking, and garage door controllers. In addition, communication systems may require FPGA support for packet switching and data security requirements. In aerospace applications, FPGA-based systems are used for navigation and guidance, satellite control, and system monitoring. Finally, medical applications require very low-latency FPGA solutions for real-time medical imaging analysis.

Working Principle

At the heart of the EP3SL110F780I3N is a FPGA fabric which consists of programmable logic elements and an interconnect structure that can be configured by a user. FPGAs are used to replace vast areas of more traditional logic and replace it with a more optimized implementation. The user’s design is written in a Hardware Description Language (HDL) and then compiled into a configuration bitstream which is then uploaded to the device. Once programmed, the configuration bitstream is stored on the device’s silicon and can be reprogrammed in the field if necessary. The FPGA can then be used to implement logic functions, interconnects, and clock resources. In addition to the FPGA fabric, the EP3SL110F780I3N device also features 1.6M slices containing 14,400Kbits of embedded RAM, two high-performance Multi-Gigabit Transceivers (MGTs), non-volatile phase-locked loops (PLLs), two 1.2V and two 1.8V power domains, and an adjustable differential clock fan-out with integrated clock jitter attenuation. The device also features numerous high-speed I/O, including single-ended and differential I/O up to 6.25Gbps and differential I/O up to 12.5Gbps.

Conclusion

The EP3SL110F780I3N Field Programmable Gate Array (FPGA) is designed to be used in a variety of applications including industrial, automotive, communications, aerospace, and medical imaging. At the heart of the device is a FPGA fabric which can be configured according to a customer’s needs. In addition to this, the FPGA also features embedded RAM, MGTs, PLLs, and multiple high-speed I/O, allowing it to be used in a variety of applications.

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