Allicdata Part #: | FD200R12KE3HOSA1-ND |
Manufacturer Part#: |
FD200R12KE3HOSA1 |
Price: | $ 65.24 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | Infineon Technologies |
Short Description: | IGBT MODULE VCES 1200V 200A |
More Detail: | IGBT Module Trench Field Stop Single Chopper 1200V... |
DataSheet: | FD200R12KE3HOSA1 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 59.30690 |
Series: | -- |
Part Status: | Active |
IGBT Type: | Trench Field Stop |
Configuration: | Single Chopper |
Voltage - Collector Emitter Breakdown (Max): | 1200V |
Power - Max: | 1050W |
Vce(on) (Max) @ Vge, Ic: | 2.15V @ 15V, 200A |
Current - Collector Cutoff (Max): | 5mA |
Input Capacitance (Cies) @ Vce: | 14nF @ 25V |
Input: | Standard |
NTC Thermistor: | No |
Operating Temperature: | -40°C ~ 125°C |
Mounting Type: | Chassis Mount |
Package / Case: | Module |
Supplier Device Package: | Module |
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FD200R12KE3HOSA1 application field and working principle
FD200R12KE3HOSA1 is a type of insulated gate bipolar transistor (IGBT) module designed for switching applications. As a module specifically designed for power applications, it offers several significant advantages over similar alternatives. FD200R12KE3HOSA1 is a 1200 volt, 200 amp module with a 1,600 volt breakdown voltage, making it well suited for applications requiring high power ratings.
The application field of FD200R12KE3HOSA1 includes motor drives, welding equipment and industrial robotic automation. Additionally, it is suitable for use in appliances, power conditioning, and high-power industrial applications.
Working Principle of FD200R12KE3HOSA1
FD200R12KE3HOSA1 utilizes the IGBT process, which enables the high saturation current to flow through the device and control the applied voltage. To ensure proper application, the switching and control of the gate voltage must occur accurately and quickly.
The FD200R12KE3HOSA1 module utilizes IGBT technology to maintain low losses and high efficiency. This is achieved by optimally controlling the gate voltage and current through the device. By controlling the gate, the base-emitter voltage of the IGBT is varied allowing for precise control of the current.
The IGBT process utilizes a gate oxide layer to control the charge carriers in the channel. This layer is separated from the channel by a P-N junction. When a gate voltage is applied, it pushes the voltage of the P-N junction below its breakdown level, allowing the current to flow through the device. Due to the gate-oxide layer in the IGBT process, the device can be used to switch devices and provide precise control over the voltage and current.
The FD200R12KE3HOSA1 module is also very fast in comparison to other IGBT devices. This is due to the nature of the IGBT process, which allows for the current to be switched on and off in a fraction of a second. The module also features a built-in heat sink which helps to dissipate the heat generated during operation.
Conclusion
The FD200R12KE3HOSA1 module is an insulated-gate bipolar transistor (IGBT) module specifically designed for use in power applications. It offers a number of advantages over other similar alternatives, including a 1200 volt, 200 amp rating with a 1600 volt breakdown voltage. Additionally, it utilizes IGBT technology to maintain low losses and high efficiency by controlling the gate voltage and current. The module is fast due to the nature of the IGBT process, and features a built-in heat sink to dissipate the heat generated during operation.
The specific data is subject to PDF, and the above content is for reference
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