FLCSMCXSPE

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FCSMCXSPE or Foundry Compatible Substrate Metal Core exchange Short Pitch Extension is a two-part composite used in high-reliability and high-current applications in military, avionics, automotive, and other type of sensitive and critical applications. It is a great alternative to traditional copper interconnection solutions for improved system performance. FCSMCXSPE provides versaltility and flexibility without sacrificing quality and reliability. The composite technology effectively replaces the copper cladding and enables the substitution of metal substrate material instead. This technology has opened a new dimension in interconnection options, allowing the creation of high-performance materials in the same sizes and shapes as traditional copper claddings.

The application fields of FCSMCXSPE include high-reliability board-level applications such as military and aerospace applications, automotive applications, telecommunications and industrial applications. The technology is suitable for any application where improved strength, durability, flexibility, and reliability are required. In addition, the FCSMCXSPE system can be used to improve thermal management during system operation. FCSMCXSPE offers excellent electrical conductivity and heat transfer characteristics, resulting in improved thermal management and better self-adaptation to changing environments.

FCSMCXSPE is composed of two layers of metal. The outer layer is the metal cladding material, which provides a protective and durable outer cover. The inner layer is the metal substrate material, which provides the electrical conductivity for the interconnection. The substrate core of the FCSMCXSPE is composed of an insulated copper foil that provides the mechanical support for the interconnection. The core foil is then covered with a dielectric layer to ensure the electrical insulation between the two metal layers. The substrate core is then covered with the outer metal layer (i.e. cladding).

FCSMCXSPE has several benefits in high current/high reliability applications. Its low electrical resistance and low thermal resistance values reduce interconnection delays resulting in improved system performance. The flexible design of the FCSMCXSPE core allows for easy and reliable interconnection of components, resulting in improved electrical and mechanical performance. In addition, the FCSMCXSPE substrate can be easily customized for any application due to its flexibility of design and the wide range of metal core foils available. This allows for the creation of custom designed interconnections with improved thermal and electrical properties.

In summary, FCSMCXSPE provides a reliable, flexible, and high-performance interconnection solution for high-reliability and high-current applications. The technology offers excellent electrical conductivity and heat transfer characteristics, resulting in improved thermal management. In addition, the large range of metal core foil designs available for the FCSMCXSPE substrate allows for the customization of the interconnection to fit any application. This technology provides a cost-effective solution for critical applications, greatly reducing both cost and risk. FCSMCXSPE is an excellent alternative to traditional copper interconnection solutions, providing improved performance and reliability.

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