H108767C

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H108767C is a silicon-based surface acoustic wave (SAW) delay line (DL) device used in high-frequency applications. It is one of the most commonly used SAW DLs due to its wide-ranging advantages. Due to its highly stable structure, it can be used in a variety of environments and is highly reliable. It is also known for its excellent high-frequency performance, making it an ideal choice for applications in the telecom and wireless sectors.

The H108767C SAW DL operates by generating an acoustic wave on a piezoelectric substrate. The substrate is exposed to an electric signal which causes it to vibrate at the desired frequency. When the signal is removed, the substrate produces a continuous standing wave with a set of discrete frequencies known as frequency-selective surfaces or FSSs. These FSSs act as reflecting elements, reflecting an acoustic wave back and forth between them. When the time delay is changed, the time duration of each frequency component is altered, resulting in a delay of the reflected signal.

The H108767C can be used in a variety of applications, such as data transport, radio-frequency (RF) signal processing, and filtering. It is especially useful in applications where the signal must be carefully time-aligned to reduce interference and distortion. It can also be used in high-frequency RF power amplifiers which require a stable, low-noise electrical signal.

The H108767C is a highly reliable SAW DL, with a wide range of features and applications. Its small size and low power consumption make it an ideal choice for portable devices. It is also highly reliable, with a typical lifetime of more than 2,000 hours and a temperature range of -40°C to +125°C. Additionally, it is highly customizable, allowing for the use of different frequencies, time delays, and temperatures. It is also easy to configure and modify, making it a great choice for OEMs and other custom projects.

In conclusion, the H108767C is a highly versatile SAW DL with a wide range of advantages. Its wide range of frequencies and time delays make it ideal for many applications, and its small size and low power consumption make it ideal for portable devices. Additionally, its highly stable structure, high reliability, and robust temperature range make it an excellent choice for high-frequency applications in telecom and wireless sectors.

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