HDAF-11-18.0-S-13-1

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The HDAF-11-18.0-S-13-1 is a rectangular connector array, edge type, mezzanine (board to board) used in a variety of applications. While it may be used in a variety of ways, the core function of the HDAF-11-18.0-S-13-1 is to facilitate reliable data transmission between multiple layers on a PCB without compromising its performance.

The HDAF-11-18.0-S-13-1 utilizes edge-type connectors instead of pin-type connectors to connect two PCBs. This ensures a reliable signal connection between two boards, as the contact surface is extended and the connector is located on the edges of the PCB instead of on the surface. This not only reduces interference, but also makes the connection stronger and more durable.

The HDAF-11-18.0-S-13-1 can be used in a variety of applications such as automotive,datacom, industrial, and medical equipment. As it has a very high degree of reliability, it can be used for high-speed data communication between multiple boards. This ensures that data transmission is uninterrupted and secure, making the product ideal for applications that require high-speed data transmission.

The HDAF-11-18.0-S-13-1 is designed to avoid solder bridging and has an increased installation rate of up to ninety-five percent. This connector also features low insertion and extraction forces. The connector also features a slim size and low profile. This allows users to install it in tight spaces with minimal obstruction.

In order to make sure that the HDAF-11-18.0-S-13-1 performs as expected and lasts for a long time, it is important to use the right materials. This includes high-reliability versions of copper or phosphor bronze contacts. The HDAF-11-18.0-S-13-1 also incorporates press-fit lances for lower insertion forces and improved contact stability.

The mating interface of the HDAF-11-18.0-S-13-1 also needs to be taken into consideration. This type of connector is ideal for a space-saving and reliable connection, as it features a mating interface that is designed specifically to stay securely locked together with minimal effort. This means that the mating interface ensures a reliable connection and minimal risk of disconnection due to vibration, thus increasing the efficiency of the system.

The HDAF-11-18.0-S-13-1 is easy to handle and install, and it comes with a long warranty period. With a wide range of applications and a solid design, the HDAF-11-18.0-S-13-1 is the perfect choice for reliable data transmission between multiple layers on a PCB.

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