HDAF-15-18.0-S-13-1

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The HDAF-15-18.0-S-13-1 is a rectangular connector array with edge type, mezzanine board to board configuration. This particular design is a robust and versatile rectangular connector and is most widely used in combination with high speed logic and microprocessor based systems. As such, it is commonly seen in a variety of embedded systems that require a reliable and durable interconnect.

The HDAF-15-18.0-S-13-1 connects to a printed circuit board (PCB) and provides an interface between the two sides of a die. It provides eight to twelve impedance-controlled transmission lines along with a combination of power and ground signals. A jackscrew mechanism is used to ensure proper contact force is applied between the contact strips and the die. The flexible latching system is available in single or double row designs with a given pitch.

Due to its robust and rugged construction, the HDAF-15-18.0-S-13-1 is a highly reliable interconnect for high speed circuits and applications. It also offers a high level of electrical performance, with excellent insertion loss and return loss when tested on a full range of radio frequency (RF) and high speed logic patterns. Furthermore, this connector is protected from the environment with an IP65 rating on all sides, making it suitable for both commercial and military use.

The HDAF-15-18.0-S-13-1 is a popular choice for use in embedded computers, industrial equipment, and high speed controllers. In addition, the connector is the ideal choice for medical, telecommunications, and avionics applications that require transmission line-controlled impedance characteristics. The connector also meets the RoHS2 standard.

All in all, the HDAF-15-18.0-S-13-1 is a highly reliable and versatile connector that is suitable for many different applications. It offers excellent electrical performance, high reliability, robust mechanical configurations, and a long service life. The connector is also RoHS2-compliant and has an IP65 rating, making it suitable for many different environmental conditions.

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