HDAF-23-18.0-S-13-1

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HDAF-23-18.0-S-13-1 is a mezzanine-style rectangular connector. It is classified into the Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) type, and consists of an array of double rows of 3-row connectors, with a device mount pad height of 18.0 mm, a contact rating of 0.25/13A, and two boards per row. The product is designed for superior flexibility, as both sides may be used for attaching wires.

The connector features an interference-fit keyed system, providing high-current density applications with a reliable connection. It is a self-wiping type of contact that eliminates the need for mechanical cleaning. Additionally, it has a weldable version for higher current ratings and higher temperature applications.

The product is designed for superior connection stability and long-term mating cycles. It is also designed to be field assignable, which reduces the risks of incorrect connection (such as in contact topology mismatch). By incorporating both an interference-fit keyed system and a self-cleaning contact configuration, the HDAF-23-18.0-S-13-1 offers superior signal integrity performance.

The connector has two different versions for a variety of applications. The HDAF-23-18.0-S-13-1HL version has a high-level contacts that uses a minimum of two vias per signal for better noise suppression. The HDAF-23-18.0-S-13-1ML version has a mid-level contacts with an improved shock and vibration rating.

It features a wide range of product functions, including power input and output, signal routing, power and ground wiring, and power/ground braid system. Power/ground braid system allows signals to be routed through the braid while maintaining a safe distance from live components. These features enable it to be used in a broad range of applications from mass storage systems, rack and enclosures, industrial PCs, and EM test systems to telecom and server applications.

The HDAF-23-18.0-S-13-1 is constructed to ensure a low-profile yet robust mounting system with minimal space required. It has a variety of mounting options, including sliding, float-on-shank, and floating-on-ratchet mount options. Additionally, its compact design supports a variety of rack-mounting configurations.

Finally, the HDAF-23-18.0-S-13-1 uses a working principle that combines the features of backplane, edge card, and board-to-board devices. Its primary working principle is to provide an efficient and reliable connection between the two boards. Additionally, this type of connector includes an array of contacts that can be connected and disconnected without having to unmount the device.

In summary, the HDAF-23-18.0-S-13-1 is an excellent choice for a wide variety of applications. Its key design features include a low-profile mounting system that provides superior connection stability and long-term durability, an interference-fit keyed system and self-cleaning contact configuration that provide superior signal integrity performance, and a variety of mounting options to accommodate a wide range of applications. Additionally, its working principle is based on backplane, edge card, and board-to-board devices, making it an ideal solution for many applications.

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