HM2H07P148

Series:	--
Packaging:	Bulk
Lead Free Status / RoHS Status:	--
Part Status:	Obsolete
Moisture Sensitivity Level (MSL):	--
Connector Type:	Shroud for Male Pins
Connector Style:	A 22
Number of Positions:	132
Pitch:	0.079" (2.00mm)
Number of Rows:	6
Mounting Type:	--
Connector Usage:	--
Features:	--
Color:	--
Note:	Contacts Not Included

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Introduction
The HM2H07P148 is a high-performance backplane interconnect family, designed to meet the ever-increasing performance demands in the embedded computing, cloud computing, data storage, and communication base station markets. It is designed to work with High I/O Cables, as well as cabled signal traces. It is a full-featured backplane connector system, featuring high pin density, low profile, and durability to meet the needs of the most demanding applications.Connector System Overview
The HM2H07P148 family is a full-featured backplane interconnection solution. It is designed to connect between two independent backplanes, which may be located some distance apart. The system is composed of two separate pieces, the connector housing and the signal contacts. Connector housings are available in two sizes to accommodate either 24 contacts or 48 contacts. Three bus configurations are available; a 2 x 12, a 3 x 8, or a 4 x 6. The signal contacts are designed to accept 28 AWG to 22 AWG stranded wire, as well as straight or pre-formed cabled signal trace. All contacts are rated for 1.5A at 500V, and are available in either tin or gold finish.Working Principle
The HM2H07P148 family is designed to be used in applications where a high density backplane interconnect is required. The primary function of the system is to provide a reliable and robust connection between two backplanes and ensure minimal signal interference and maximum signal integrity. The contact system works by connecting each contact of one backplane to the corresponding contact of the other backplane. To ensure a secure connection, each contact contact is fitted with a spring-loaded contact point that is biased with an applied force and clamped between the two backplanes. This bias force prevents any movement of the contact and thus ensures good conductivity and signal integrity.Design Features
The HM2H07P148 family of backplane interconnects are designed to perform in the most demanding environments. Its design features include low profile, high contact density, and durability. The connectors are designed to be very low profile, which allows them to be easily integrated into compact devices. The contacts are spaced very closely together to accommodate high density signal routing. They are also designed to be very durable, with a high insertion/withdrawal force of 200N. They are also designed to be low noise by providing good mechanical performance and shielding against EMI.Application Field
The HM2H07P148 family of backplane interconnects are designed for a wide variety of applications. It is well suited for embedded computing applications, cloud computing, data storage, and communication base station markets. It can be used both in industrial and commercial applications, as it is designed to withstand high temperature, vibration, and shock. It is also well suited for applications where a high pin density, low profile, and minimal signal interference are needed.Conclusion
The HM2H07P148 is a high-performance and high-density backplane interconnect family, designed to meet the needs of the most demanding applications. It features a low profile design, high contact density, and durability to ensure robustness and reliability. Its working principle is based on the use of spring-loaded contacts, which are biased to ensure a secure and reliable connection. It is designed for a wide range of applications, including embedded computing, cloud computing, data storage, and communication base stations.

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