IT3D-200S-BGA(57) Allicdata Electronics

IT3D-200S-BGA(57) Connectors, Interconnects

Allicdata Part #:

H11781-ND

Manufacturer Part#:

IT3D-200S-BGA(57)

Price: $ 12.38
Product Category:

Connectors, Interconnects

Manufacturer: Hirose Electric Co Ltd
Short Description: CONN RCPT MATE SIDE 200POS SMD
More Detail: 200 Position Connector Receptacle, Non-Gendered Su...
DataSheet: IT3D-200S-BGA(57) datasheetIT3D-200S-BGA(57) Datasheet/PDF
Quantity: 1000
72 +: $ 11.24550
Stock 1000Can Ship Immediately
$ 12.38
Specifications
Series: IT3
Packaging: Tray 
Part Status: Active
Connector Type: Receptacle, Non-Gendered
Number of Positions: 200
Pitch: 0.069" (1.75mm)
Number of Rows: 40
Mounting Type: Surface Mount
Features: Mating Side
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 15mm ~ 40mm
Height Above Board: --
Description

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The IT3D-200S-BGA(57) is part of a class of rectangular connectors known as arrays, edge types, mezzanine (board to board) connectors. This type of connector provides vital interconnection between motherboards, daughter boards, other printed circuit boards, and components that are involved in various types of technology. It is constructed with arrays of pins, which are installed in suitable cavities in order to provide a mechanically and electrically secure connection. When assemblies are put together, these connectors guarantee maximum reliability and maximum performance.

The IT3D-200S-BGA(57) is specifically designed to provide an powerful electrical connection between two mating surfaces, with an extremely low profile. This connector is capable of carrying both power and signal transmissions, and is commonly used in various types of electronic devices and systems. With this connector, there is minimal contact resistance and proof against environment stress, temperature cycling, humidity, and vibration.

The IT3D-200S-BGA(57) has a pitched terminal array consisting of 50 discrete pins in the form of a ball grid array, with a pitch of 0.8mm. The array also has a Solderless Contact-Bonding interface, which can be securely attached to the substrate. This connector has a total of 57 contacts, and its contact arrangement allows for a low profile design which provides a high level of robustness. It is also built with a stainless steel locking system which keeps the two mating surfaces locked in place, and allows for a high level of vibration resistance and shock protection.

In terms of performance, the IT3D-200S-BGA(57) is rated to 5.1 Gb/s, which is sufficient for multi-gigabit data communication. Additionally, it has a high current rating of 8 Amps, and a wide frequency range up to 16 GHz. As such, this connector is well suited to the requirements of high speed and mission-critical electronics. Furthermore, this connector is designed with a range of safety features including ESD protection, anti-tamper and secure locking, and secure interrupt features which can be easily implemented.

The IT3D-200S-BGA(57) is commonly used in all sorts of technology, including telecommunications, industrial, aerospace, military, and networking systems. It is also suitable for applications which require high reliability and performance over extended periods of time, such as medical and automotive products. The IT3D-200S-BGA(57) connector is an all-purpose solution that is suitable for a wide range of applications, and its reliability and performance make it a great choice for use in any environment.

The specific data is subject to PDF, and the above content is for reference

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