IT3D-200S-BGA(37) Connectors, Interconnects

Series:	IT3
Packaging:	Tray
Part Status:	Active
Connector Type:	Receptacle, Non-Gendered
Number of Positions:	200
Pitch:	0.069" (1.75mm)
Number of Rows:	40
Mounting Type:	Surface Mount
Features:	Mating Side
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)
Mated Stacking Heights:	15mm ~ 40mm
Height Above Board:	--

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Introduction

The IT3D-200S-BGA-37 is a rectangular-array edge type mezzanine connector for the connection of two BGA boards. These BGA boards can be stacked in any creative combination for the purpose of product design and development. Due to its great space efficiency and ease of use, the IT3D-200S-BGA-37 is a popular solution for inter-connecting various board components. The connector is designed with press-fit technology to ensure a reliable and secure connection with minimum effort.

Application Field

The IT3D-200S-BGA-37 is a prominent choice in a wide variety of industries, ranging from consumer electronics to automotive, military, and industrial control. Specialized applications include complex electronics, e-commerce linking, data collection, and satellite communication.One of the most common uses for the IT3D-200S-BGA-37 is in embedded systems. Due to its robust design and easy installation, the connector proves to be an optimal solution for connecting boards in limited spaces. In addition, the connector has received approval from UL and CSA for its high-quality components, making it one of the best choices in this area.Other applications of the IT3D-200S-BGA-37 include assembly management systems, large-scale automated systems, and 3D printing, where its versatility and strength can be fully utilized.

Working Principle

The IT3D-200S-BGA-37 is designed with a gold-plated contact system to ensure reliable and robust connections between two boards. The contact fingers are accurately-molded to the board edges, preventing them from any kind of shock and vibration. Moreover, the contacts are made of metallic metal and have a life cycle of 50,000 insertion/withdrawal operations.To ensure a reliable connection, the contact fingers are designed with a snap-in feature. This allows the connector to be installed without the need for special tools or equipment. Simply press the connector onto the board edges to secure the desired connection.The IT3D-200S-BGA-37 also features a DIP housing which comes in either 11 pins or 14 pins. This makes it compatible with a wide variety of board sizes and shapes. In addition, the connector also comes with a lanyard hole to ensure the stable connection of the two boards.

Conclusion

Overall, the IT3D-200S-BGA-37 is a great option for connecting two BGA boards. This rectangular-array edge type mezzanine connector is popular across many different industries for its robust design and compatibility with a variety of board sizes and shapes. The reliable and secure press-fit connection requires no tools or special equipment to install. In addition, the connector is UL and CSA approved for its high quality components. With its ability to handle shock and vibration, the IT3D-200S-BGA-37 is a great choice in any application.

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