IT3D-300S-BGA(57)

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) - IT3D-300S-BGA(57) application field and working principle

Introduction

IT3D-300S-BGA (57) is a type of rectangular connector array. It belongs to the Edge Type, Mezzanine (Board to Board) family of connectors. It has been designed as a surface mount BGA in order to provide a box-out, low profile solution. This type of connector is mainly used for fine pitch applications like MEMS and ASICs.

The IT3D-300S-BGA (57) offers a total of 57 contact points and can handle up to 16A of current. It features a 0.3mm pitch with a 4-row, 9-bank configuration. It also comes with two optional shock straps to help improve shock and vibration resistance.

Design Features

The main design features of the IT3D-300S-BGA (57) include:

• The connector features a 0.3 mm pitch with a 4-row, 9-bank configuration.
• It is a surface mount BGA designed to provide a box-out, low profile solution.
• The maximum current rating is 16A.
• The connector comes with two optional shock straps to help improve shock and vibration resistance.
• The contact pin is made of gold-plating, which ensures reliable electrical connections.
• The body of the connector is made of liquid crystal polymer, which offers high durability and robustness.

Application Field

The IT3D-300S-BGA (57) is mostly used for fine pitch applications, such as MEMS or ASICs. The connector is perfect for connecting multiple boards at a low profile thanks to the box-out design. This type of connector is often used in computer motherboards, smartphone components, and high-density FPC connections.

Working Principle

The IT3D-300S-BGA (57) works on the principle of electrical contacts. The contact pins are made of gold-plated phosphor bronze, which offers excellent electrical and mechanical properties. The connector is mounted on the board with reflow-soldering. This ensures a secure and durable connection. The optional shock straps help reduce stress on the connector when exposed to vibration and shock.

Conclusion

The IT3D-300S-BGA (57) is an edge type, mezzanine (board to board) connector array perfect for low-profile, high-current applications. It is mostly used in computer motherboards, smartphones, and other high-density FPC connections. It is designed with a 0.3mm pitch with a 4-row, 9-bank configuration and comes with two optional shock straps for improved shock and vibration resistance. The contact pin is made of gold-plated phosphor bronze for high reliability and robustness. The connector offers excellent electrical and mechanical connection properties.

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