Allicdata Part #: | 294-1091-ND |
Manufacturer Part#: |
LA363B4CB |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK PWR 1.00"H BLACK TO-3 |
More Detail: | Heat Sink TO-3 Aluminum Board Level |
DataSheet: | LA363B4CB Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Type: | Board Level |
Package Cooled: | TO-3 |
Attachment Method: | Bolt On |
Shape: | Rhombus |
Length: | 1.630" (41.40mm) |
Width: | 1.290" (32.77mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 0.70°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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LA363B4CB is a thermal - heat sink device which is typically used for cooling purposes. It is designed to transfer heat away from an electronic component or system by cooling it with a liquid or a gas. The device can also be used to maintain a temperature range in a closed system, such as that of an enclosure or computers.The main working principle of LA363B4CB is to use a combination of radiative and convective heat transfer. Radiative heat transfer, also known as radiant heat transfer, is the process of heat traveling in straight lines from a hot surface to a cooler one. This form of heat transfer is a relatively slow process and is not suitable for high heat flux applications.On the other hand, convective heat transfer is the process of heat travelling from one location to another through a medium such as air or liquid. The process makes use of a heat sink, which is typically made from a metal material with a high thermal conductivity and which is normally designed in the shape of a billowing sheet. The heat sink helps to keep the heat away from the component or the system, dissipating it into the environment.The LA363B4CB thermal - heat sink is typically constructed with an optimized shape and robust material. This ensures that it can dissipate large amounts of heat quickly and efficiently. Additionally, the device typically features passive components such as fans and heat spreaders which work in combination with the heat sink to further reduce the dissipated heat.When it comes to its application field, the LA363B4CB thermal - heat sink device is most widely used in consumer electronics, medical devices, industrial automation, and automotive applications. It is also often used to cool down overheated CPUs, components and other electronics in computer systems such as desktops, laptops and servers.In conclusion, the LA363B4CB thermal - heat sink device is an extremely useful and efficient piece of equipment which is capable of transferring a large amount of heat away from electronic components and systems quickly and effectively. Its optimized shape and robust material make it an ideal choice for a variety of applications and industries.
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