LA363B4CB Allicdata Electronics
Allicdata Part #:

294-1091-ND

Manufacturer Part#:

LA363B4CB

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK PWR 1.00"H BLACK TO-3
More Detail: Heat Sink TO-3 Aluminum Board Level
DataSheet: LA363B4CB datasheetLA363B4CB Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: Board Level
Package Cooled: TO-3
Attachment Method: Bolt On
Shape: Rhombus
Length: 1.630" (41.40mm)
Width: 1.290" (32.77mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 0.70°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

LA363B4CB is a thermal - heat sink device which is typically used for cooling purposes. It is designed to transfer heat away from an electronic component or system by cooling it with a liquid or a gas. The device can also be used to maintain a temperature range in a closed system, such as that of an enclosure or computers.The main working principle of LA363B4CB is to use a combination of radiative and convective heat transfer. Radiative heat transfer, also known as radiant heat transfer, is the process of heat traveling in straight lines from a hot surface to a cooler one. This form of heat transfer is a relatively slow process and is not suitable for high heat flux applications.On the other hand, convective heat transfer is the process of heat travelling from one location to another through a medium such as air or liquid. The process makes use of a heat sink, which is typically made from a metal material with a high thermal conductivity and which is normally designed in the shape of a billowing sheet. The heat sink helps to keep the heat away from the component or the system, dissipating it into the environment.The LA363B4CB thermal - heat sink is typically constructed with an optimized shape and robust material. This ensures that it can dissipate large amounts of heat quickly and efficiently. Additionally, the device typically features passive components such as fans and heat spreaders which work in combination with the heat sink to further reduce the dissipated heat.When it comes to its application field, the LA363B4CB thermal - heat sink device is most widely used in consumer electronics, medical devices, industrial automation, and automotive applications. It is also often used to cool down overheated CPUs, components and other electronics in computer systems such as desktops, laptops and servers.In conclusion, the LA363B4CB thermal - heat sink device is an extremely useful and efficient piece of equipment which is capable of transferring a large amount of heat away from electronic components and systems quickly and effectively. Its optimized shape and robust material make it an ideal choice for a variety of applications and industries.

The specific data is subject to PDF, and the above content is for reference

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