| Allicdata Part #: | 294-1092-ND |
| Manufacturer Part#: |
LA363B5CB |
| Price: | $ 0.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CTS Thermal Management Products |
| Short Description: | HEATSINK PWR 1.25"H BLACK TO-3 |
| More Detail: | Heat Sink TO-3 Aluminum Board Level |
| DataSheet: |  LA363B5CB Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | LA363B5 |
| Part Status: | Obsolete |
| Type: | Board Level |
| Package Cooled: | TO-3 |
| Attachment Method: | Bolt On |
| Shape: | Rhombus |
| Length: | 1.630" (41.40mm) |
| Width: | 1.290" (32.77mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.250" (31.75mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | 11.10°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal-Heat Sinks are the most secure component in the application of LA363B5CB Heat Sinks. Thermal-Heat Sinks are basically a network of heat spreaders, which are designed to absorb and evenly distribute thermal energy during electronic device operations. Thermal-Heat Sinks are critical for operating system stability, as they provide a cooling medium for the various components of an electronic device.
The LA363B5CB Heat Sink is an advanced heat sink that has a unique design. It features a copper baseplate, making it ideal for light-weight devices and cases. The copper baseplate allows for greater thermal performance than other designs. In addition, the baseplate is treated with an anodized coating that further ensures heat transfer. The unique design also cuts down on noise, allowing for quieter system operation.
The LA363B5CB Heat Sink uses a combination of air flow and thermal mass to extract and disperse heat away from a device\'s critical components. This combination of air flow, thermal mass, and thermal-spreaders creates an optimal cooling system. As the air flow moves through the thermal mass, it absorbs the heat and draws it away from the device. The thermal mass then disperses the heat away from the device and to a remote source.
The LA363B5CB Heat Sink also features a Smart-Fan. The Smart-Fan works by monitoring the temperature of the device and actuating itself to move cool air into the center of the device and away from the critical components. This allows for greater thermal performance and cooling. The Smart-Fan also allows for less power consumption while still providing efficient cooling.
The LA363B5CB Heat Sink is an ideal heat sink for many applications. The combination of advanced thermal design, anodized baseplate, and Smart-Fan creates an optimal cooling system for any device. The thermal-spreaders ensure that heat is evenly distributed across the device, allowing for a more uniform cooling system. The Smart-Fan feature provides efficient cooling, while ensuring noise levels stay low. With such features, the LA363B5CB is the perfect heat sink for any application.
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