LFE3-70E-6FN672I Allicdata Electronics
Allicdata Part #:

LFE3-70E-6FN672I-ND

Manufacturer Part#:

LFE3-70E-6FN672I

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Lattice Semiconductor Corporation
Short Description: IC FPGA 380 I/O 672FBGA
More Detail: N/A
DataSheet: LFE3-70E-6FN672I datasheetLFE3-70E-6FN672I Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: ECP3
Part Status: Obsolete
Number of LABs/CLBs: 8375
Number of Logic Elements/Cells: 67000
Total RAM Bits: 4526080
Number of I/O: 380
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA
Supplier Device Package: 672-FPBGA (27x27)
Base Part Number: LFE3-70
Description

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Field Programmable Gate Arrays (FPGAs) are semiconductor devices that are reconfigurable in the field and represent a revolutionary technology in the embedded industry. FPGAs are able to rapidly prototype and implement applications that were either impossible or cost-prohibitive on traditional architectures. One example of a field programmable gate array is the LFE3-70E-6FN672I.

The LFE3-70E-6FN672I is a mid-range FPGA designed for enhanced high-performance embedded applications. With a maximum signal processing performance of 190k gate equivalent and a low stand-by power of 3 mW, the LFE3-70E-6FN672I has been created for efficient applications in the communications, video and imaging, and digital signal processing (DSP) market segments.

The LFE3-70E-6FN672I is built around a four-layer architecture consisting of a logic layer, a reprogrammable interconnect layer, a routing layer, and a memory layer. This architecture allows the logic layer to be reconfigured on a device-by-device basis, allowing extensive customization of the design on a per-application basis. The four layers allow for a more flexible, robust and optimized design, which can dramatically reduce the size, cost and power consumption of the overall solution.

This FPGA also boasts an impressive arrayof features that can enable more efficient embedded design solutions. It utilizes dedicated hyperbolic memory blocks, allowing for both single-ported and dual-ported access to on-chip memory, while a dedicated routing layer allows for efficient implementation of various bus structures. It also supports multiple-port access to external memory, allowing for a reduction in overall power consumption. Additionally, the LFE3-70E-6FN672I offers a microprocessor interface for designing micro-coded applications.

In terms of the working principle of the LFE3-70E-6FN672I, it is similar to that of other FPGAs. It utilizes a set of reconfigurable logic blocks and routing resources to implement arbitrary logic functions. These logic blocks are organized in a matrix of rows and columns, and the routing resources are divided into two separate planes. The programming logic within the logic blocks can be changed on the fly, allowing for dynamic re-configuration or optimization with respect to functionality, timing or power consumption.

Given its impressive feature set and performance capabilities, the LFE3-70E-6FN672I is ideally suited for applications requiring enhanced high-performance embedded designs. These include image processing, video conferencing, DSP algorithms, and high-speed data acquisition systems, as well as a variety of industrial control applications.

In summary, the LFE3-70E-6FN672I is a powerful, low-power field programmable gate array that is particularly suited for embedded applications requiring high performance, flexibility, and power efficiency. With its flexible feature set, impressive performance, and low cost, it is well worth considering for anyone looking for a powerful embedded solution.

The specific data is subject to PDF, and the above content is for reference

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